Title:
DIE BOARD WITH SIDE PAD FOR PREVENTING STATIC ELECTRICITY
Document Type and Number:
WIPO Patent Application WO/2010/074390
Kind Code:
A1
Abstract:
The present invention relates to a die board comprising: blades of a rectangular- or triangular-shaped frame attached to one plane of a wood board to cut a film to a specified size; and a cushion pad positioned in empty spaces around the blades to cover the blades. More specifically, the die board comprises a ground wire which goes through the wood board and is connected to each of the blades and the cushion pad for the purpose of releasing to the outside the static electricity generated between the blades and the cushion pad. Thereby, the die board prevents the film from sticking to a panel or the blades due to friction occurring during cutting of the film. Also, the die board includes one or a plurality of insertion grooves formed on one or both sides of a cutting blade at a certain distance, wherein an iron bar for reinforcement support may be provided in the insertion groove(s).
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Inventors:
PARK, Sun Hoo (404 Lexbil, 946 Siheung-dong Geumcheon-gu, Seoul 153-030, 153-030, KR)
Application Number:
KR2009/005336
Publication Date:
July 01, 2010
Filing Date:
September 18, 2009
Export Citation:
Assignee:
KDS INTECH CO., LTD. (674-1 Siheung-dong, Geumcheon-gu, Seoul 153-030, 153-030, KR)
주식회사 케이디에스인텍 (서울특별시 금천구 시흥동 674-1번지, 153-030 Seoul, 153-030, KR)
주식회사 케이디에스인텍 (서울특별시 금천구 시흥동 674-1번지, 153-030 Seoul, 153-030, KR)
International Classes:
B26F1/44
Attorney, Agent or Firm:
CHOI, Hak Hyun (301 3F, Woojoo Building 140-29 Gasan-Dong,Geumcheon-ku, Seoul 153-801, 153-801, KR)
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