Title:
DIE BONDING METHOD FOR LED AND SPRAYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/087940
Kind Code:
A1
Abstract:
A die bonding method for an LED and a spraying device, comprising: providing a substrate provided with a bonding pad and a white oil layer covering a circuit; then, placing a steel mesh on the substrate; then, spraying a suspension containing solder paste on the bonding pad by means of the spraying device to form a solder paste film layer; and finally, carrying out a reflow soldering process. The solder paste is prepared on the bonding pad by means of spray coating, thereby avoiding the phenomenon that a chip is tilted or short-circuited due to the pulling of the solder paste in the reflow soldering process, and further avoiding the uneven brightness of the surface light source.
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Inventors:
YANG YONG (CN)
Application Number:
PCT/CN2019/091463
Publication Date:
May 07, 2020
Filing Date:
June 17, 2019
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L33/00; H01L21/67; H01L33/48
Foreign References:
CN109599461A | 2019-04-09 | |||
CN102909143A | 2013-02-06 | |||
CN104056753A | 2014-09-24 | |||
CN203578047U | 2014-05-07 | |||
US20110079814A1 | 2011-04-07 |
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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