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Patent Searching and Data


Title:
DIE DEVICE EQUIPPED WITH ECCENTRIC BUSH AND SWAGING POSITION ADJUSTMENT METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/115563
Kind Code:
A1
Abstract:
A die device 10 having: an upper die 12 equipped with a bending punch 11; a lower die 15 equipped with a die 14 in which a die hole 13 mating with the bending punch 11 is formed; and a stripper plate 17 that moves up and down in conjunction with the upper die 12, thereby pressing a material to be punched 16 against the lower die 15 and guiding a tip portion of the bending punch 11 into the die hole 13 during punching. Mounted on the stripper plate 17 is an eccentric bush 8 that allows the tip portion of the bending punch 11 to penetrate therethrough and causes the axial center position of the tip portion of the bending punch 11 to be aligned with the axial center position of the die hole 13.

Inventors:
TOYOMARU Yohei (Inc. 10-1, Komine 2-chome, Yahatanishi-ku, Kitakyushu-sh, Fukuoka 88, 〒8078588, JP)
Application Number:
JP2016/083599
Publication Date:
July 06, 2017
Filing Date:
November 11, 2016
Export Citation:
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Assignee:
MITSUI HIGH-TEC, INC. (10-1, Komine 2-chome Yahatanishi-ku, Kitakyushu-sh, Fukuoka 88, 〒8078588, JP)
International Classes:
B21D28/00; B21D28/02; B21D28/34; B21D39/03
Foreign References:
JPH10243614A1998-09-11
JPH10277668A1998-10-20
JPH0311957A1991-01-21
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (Toranomon East Bldg. 8F, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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