Title:
DIE DEVICE FOR PIERCING PROCESS
Document Type and Number:
WIPO Patent Application WO/2018/199345
Kind Code:
A1
Abstract:
The present invention relates to a die device for a piercing process, the die device comprising: a lower die part on which a material is seated; an upper die part which is disposed over the lower die part, is vertically moved, and forms a piercing hole through the material; a guide part which is disposed under the lower die part and guides a scrap generated at the time of material processing; and an air injection part for injecting air to the guide part to move the scrap. Therefore, the device can quickly discharge a scrap.
Inventors:
LEE KYUNG ROK (KR)
Application Number:
PCT/KR2017/004369
Publication Date:
November 01, 2018
Filing Date:
April 25, 2017
Export Citation:
Assignee:
H K CO LTD (KR)
International Classes:
B21D31/02; B21D37/10; B21D45/02
Foreign References:
| KR20130083188A | 2013-07-22 | |||
| KR20020054744A | 2002-07-08 | |||
| KR101715623B1 | 2017-03-13 | |||
| KR20100042013A | 2010-04-23 | |||
| KR20160120523A | 2016-10-18 |
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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