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Patent Searching and Data


Title:
DIE AND DIE DEVICE
Document Type and Number:
WIPO Patent Application WO/2003/106066
Kind Code:
A1
Abstract:
A die device, wherein cores (15) having discharge ports (13) communicating with die holes (9) are installed in die bodies (11) having the die holes (9) for punching out a work, a plurality of fluid jetting ports (25) jetting fluid in the lower directions of the discharge holes (13) are provided in the cores (15), the inflow ports (27) allowing the compressed fluid to flow into the fluid jetting ports (25) are provided in the die bodies (11), the cores (13) are formed of a resin and the discharge holes are formed in tapered holes larger in diameter toward the lower side, and peripheral grooves (29) communicating with the inflow ports (27) are provided in the outer peripheral surfaces of the die bodies (11).

Inventors:
NAITO KINSHIRO (JP)
SHIMIZU MASAYUKI (JP)
ENDO SHIGERU (JP)
MATSUMOTO TAKASHI (JP)
NAKAI HIROSHI (JP)
KOBAYASHI HIROYUKI (JP)
Application Number:
PCT/JP2003/007674
Publication Date:
December 24, 2003
Filing Date:
June 17, 2003
Export Citation:
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Assignee:
AMADA CO LTD (JP)
NAITO KINSHIRO (JP)
SHIMIZU MASAYUKI (JP)
ENDO SHIGERU (JP)
MATSUMOTO TAKASHI (JP)
NAKAI HIROSHI (JP)
KOBAYASHI HIROYUKI (JP)
International Classes:
B21D28/34; B21D45/00; B26D7/18; B26F1/40; (IPC1-7): B21D28/00; B21D28/34; B21D28/36; B21D45/04; B21D45/08
Foreign References:
JPH05261454A1993-10-12
JPH1044099A1998-02-17
JP2000051966A2000-02-22
JPH0970797A1997-03-18
JPH07241634A1995-09-19
JPH07155865A1995-06-20
JPS49713Y11974-01-09
JPH08238528A1996-09-17
US5907985A1999-06-01
Other References:
See also references of EP 1535676A4
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon Daiichi Building 2-3, Toranomon 1-chom, Minato-ku Tokyo, JP)
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