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Patent Searching and Data


Title:
DIE DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/032183
Kind Code:
A1
Abstract:
A die device where an adhesive agent can be excellently fed without an increase in the size of dies and without drips of the agent. A die (2) has a blanking punch (3) for punching out a core along its outer periphery and also has a repressing punch (4) disposed in a through hole (31) formed in the blanking punch (3). The blanking punch (3) presses, in punching out and stacking the core (7), a staking part (73) of the punched-out core (7) against the staking parts (73) of cores (7) already punched out and stacked. The repressing punch (4) has a punch body (41) having in it an adhesive agent passage (42) penetrating in the axial direction of the body, a spool (8) disposed in a slidable manner so as to face the tip of the punch body (41) with a predetermined clearance (G1) in between and placed so that its tip is projected by a predetermined amount from the tip of the blanking punch (3), and a pressing spring (9) for sealing the spool (8) by pressing it against the forward end of the through hole (31) of the blanking punch (3).

Inventors:
FUJINO TOSHIO (JP)
SHIBAYAMA KATSUJI (JP)
Application Number:
PCT/JP2006/316402
Publication Date:
March 22, 2007
Filing Date:
August 22, 2006
Export Citation:
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Assignee:
YASKAWA DENKI SEISAKUSHO KK (JP)
FUJINO TOSHIO (JP)
SHIBAYAMA KATSUJI (JP)
International Classes:
H02K15/02; B21D28/02; H01F41/02
Foreign References:
JP2002151339A2002-05-24
JP2001321850A2001-11-20
JP2001045717A2001-02-16
JP2001009532A2001-01-16
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