Title:
DIE HOLDER DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/005057
Kind Code:
A1
Abstract:
A die holder device (1) is provided with a die holder (2) and a clamp cover (3). The die holder (2) has a seating surface, which the lower surface of a die (60) is seated on, and a holding surface (7a), which the outer circumference of the die (60) presses against. The clamp cover (3) can move back and forth on the upper part of a stepped part (8) of the die holder (2) and can move up and down between a separation position (P2) and a lowered position (P3). The die (60) is held against the holding surface and fixed in a position near the holding surface (7a). Provided are a movement restricting mechanism (20), which restricts the back and forth movement of the clamp cover (3) in a position that fixes the die (60); a release operation tool (25), which releases the restrictions; and a lifting mechanism (30), which is able to lift the die (60) by protruding multiple lifting members (31), which are dispersed around the seating surface on both sides, higher than the seating surface.
Inventors:
SAKAMOTO, Hiroichi (LTD. Inuyama Plant 2, Aza-Nakajima, Oaza-Hashizume, Inuyama-sh, Aichi 02, 〒4848502, JP)
Application Number:
JP2011/061259
Publication Date:
January 12, 2012
Filing Date:
May 17, 2011
Export Citation:
Assignee:
MURATA MACHINERY, LTD. (3 Minami Ochiai-cho, Kisshoin Minami-ku, Kyoto-sh, Kyoto 26, 〒6018326, JP)
村田機械株式会社 (〒26 京都府京都市南区吉祥院南落合町３番地 Kyoto, 〒6018326, JP)
村田機械株式会社 (〒26 京都府京都市南区吉祥院南落合町３番地 Kyoto, 〒6018326, JP)
International Classes:
B21D28/34; B21D28/36
Attorney, Agent or Firm:
SUGIMOTO, Shuji et al. (Higobashi Nittai Bldg, 10-2 Edobori 1-chome, Nishi-ku, Osaka-sh, Osaka 02, 〒5500002, JP)
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Claims:
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