Title:
DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION
Document Type and Number:
WIPO Patent Application WO2007130643
Kind Code:
B1
Abstract:
A high voltage semiconductor module has a leadframe with spaced pads which is connected to a heat sink plate by a curable insulation layer on the top of the plate. Semiconductor die may be soldered to the leadframe pads before or after assembly to the plate. The insulation layer may be a curable epoxy or a B stage IMS plate.
Inventors:
HAUENSTEIN HENNING M (US)
MARCINKOWSKI JACK (US)
LIN HENY (US)
MARCINKOWSKI JACK (US)
LIN HENY (US)
Application Number:
PCT/US2007/010950
Publication Date:
June 19, 2008
Filing Date:
May 04, 2007
Export Citation:
Assignee:
INT RECTIFIER CORP (US)
HAUENSTEIN HENNING M (US)
MARCINKOWSKI JACK (US)
LIN HENY (US)
HAUENSTEIN HENNING M (US)
MARCINKOWSKI JACK (US)
LIN HENY (US)
International Classes:
H01L23/24
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