Title:
DIE AND METHOD OF MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2010/116728
Kind Code:
A1
Abstract:
A die comprising: a base material (12) consisting of glass or plastic; an inorganic base layer (14) formed on the surface of the base material (12); a buffer layer (16)formed on the inorganic base later (14) and containing aluminum; an aluminum layer (18a) formed on the surface of the buffer layer (16); and a porous alumina layer (20) formed on the surface of the aluminum layer (18a). The porous alumina layer (20) comprises recesses (22) each having a two-dimensional size not smaller than 10 nm but not greater than 500 nm when viewed in the direction normal to the surface. The die has excellent adhesion properties between the aluminum layer and the base material.
Inventors:
HAYASHI, Hidekazu (())
林秀和 (())
MINOURA, Kiyoshi (())
林秀和 (())
MINOURA, Kiyoshi (())
Application Number:
JP2010/002518
Publication Date:
October 14, 2010
Filing Date:
April 06, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
HAYASHI, Hidekazu (())
林秀和 (())
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
HAYASHI, Hidekazu (())
林秀和 (())
International Classes:
C25D11/04; B29C33/38; B29C33/42; B29C59/02; C25D11/12; G02B1/11
Attorney, Agent or Firm:
OKUDA, Seiji (OKUDA & ASSOCIATES, 10th Floor Osaka Securities Exchange Bldg., 8-16, Kitahama 1-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
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