Title:
ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS
Document Type and Number:
WIPO Patent Application WO2004100194
Kind Code:
A3
Abstract:
A transformer integrated on a die, the transformer comprising a set of conductive lines (302) formed on the die within one layer and interconnected among each other so that no two lines belonging to any one winding are nearest neighbors. The set of conductive lines (302) is surrounded by a magnetic material (304), which may be amorphous CoZrTa, CoFeHfO, CoAlO, FeSiO, CoFeAlO, CoNbTa, CoZr, and other amorphous cobalt alloys. The transformer may be operated at frequencies higher than 10 MHz and as high as 1 GHz, with relatively low resistance and relatively high magnetic coupling between the windings.
More Like This:
| WO/2004/049675 | ARRANGEMENT OF AN INDUCTIVE COUPLER FOR POWER LINE COMMUNICATIONS |
| JP2022133847 | DIGITAL ISOLATOR |
Inventors:
GARDNER DONALD
SCHROM GERHARD
HAZUCHA PETER
SCHROM GERHARD
HAZUCHA PETER
Application Number:
PCT/US2004/011420
Publication Date:
December 29, 2004
Filing Date:
April 14, 2004
Export Citation:
Assignee:
INTEL CORP (US)
International Classes:
H01F19/08; H01F27/28; H01P1/205; H01F27/29; (IPC1-7): H01F19/08; G01F1/26; H01F19/04; H01F27/28
Foreign References:
| US20030001713A1 | 2003-01-02 | |||
| US5583474A | 1996-12-10 | |||
| US20010052837A1 | 2001-12-20 | |||
| US20030001709A1 | 2003-01-02 | |||
| FR2369694A1 | 1978-05-26 |
Other References:
MINO M ET AL.: "A new planar microtransformer for use in micro-switching converters", IEEE TRANSACTIONS ON MAGNETICS, vol. 28, no. 4, July 1992 (1992-07-01), pages 1969 - 1973, XP002299244
MATSUMOTO S ET AL: "INTEGRATION OF A POWER SUPPLY FOR SYSTEM-ON-CHIP", IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS, COMMUNICATIONS AND COMPUTER SCIENCES, INSTITUTE OF ELECTRONICS INFORMATION AND COMM. ENG. TOKYO, JP, vol. E80-A, no. 2, 1 February 1997 (1997-02-01), pages 276 - 282, XP000752158, ISSN: 0916-8508
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22)
MATSUMOTO S ET AL: "INTEGRATION OF A POWER SUPPLY FOR SYSTEM-ON-CHIP", IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS, COMMUNICATIONS AND COMPUTER SCIENCES, INSTITUTE OF ELECTRONICS INFORMATION AND COMM. ENG. TOKYO, JP, vol. E80-A, no. 2, 1 February 1997 (1997-02-01), pages 276 - 282, XP000752158, ISSN: 0916-8508
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22)
Download PDF:
Previous Patent: CONDUCTOR ELEMENT ARRANGEMENT
Next Patent: FIXING DEVICE, IN PARTICULAR FOR A SAFETY SWITCH
Next Patent: FIXING DEVICE, IN PARTICULAR FOR A SAFETY SWITCH