Title:
DIE FOR MOLDING DISK SUBSTRATE AND METHOD OF MANUFACTURING DISK SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2004/078446
Kind Code:
A1
Abstract:
A die for molding a disk substrate capable of forming fine recessed and projected pits and grooves up to the outer periphery of the disk substrate by preventing low heat conductive elements from peeling off and burrs from occurring on the outer periphery thereof, comprising a first base die, a second base die disposed oppositely to the first base die, a first low heat conductive element fixed to the first base die, a stamper fixed onto the first low heat conductive element, a second low heat conductive element fixed onto the second base die, and a ring-like regulating member fitted to and in slidable contact with either of the first and second low heat conductive elements. The die is characterized in that the end part of the ring-shaped regulating member is positioned within the range of the outer peripheral side face of the low heat conductive element in slidable contact therewith.
Inventors:
INOUE KAZUO
Application Number:
PCT/JP2004/002183
Publication Date:
September 16, 2004
Filing Date:
February 25, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
INOUE KAZUO
INOUE KAZUO
International Classes:
B29C45/26; B29D17/00; B29C33/38; (IPC1-7): B29C33/38; B29C33/30
Foreign References:
| JP2003019717A | 2003-01-21 | |||
| JPH0866945A | 1996-03-12 | |||
| JPH1148291A | 1999-02-23 | |||
| JPH0573720U | 1993-10-08 | |||
| JP2001310358A | 2001-11-06 | |||
| JP2001334534A | 2001-12-04 |
Attorney, Agent or Firm:
Kawamiya, Osamu (3-7 Shiromi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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