Title:
DIE STRUCTURE, PRESSING DEVICE, AND PRESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/030571
Kind Code:
A1
Abstract:
Provided is a die structure and so forth by which effects of unstable positioning precision due to a press main unit can be reduced, adjustment of a pressing device by an experienced worker is unnecessary, productivity is excellent, and attachment to and detachment from the press main unit is easy. A die structure 1 includes a lower die 3 fixed to a fixing stage 2, an upper die 4 provided above the lower die 3, a first elastic member 11 and a stopper 10 provided between the upper die 4 and the lower die 3, and a pressure adjusting device 6 linked to a movable stage 5 side of the upper die 4. When not applying pressure in pressing, the first elastic member 11 separates the upper die 4 and the lower die 3, and when applying pressure in pressing, a working piece 30 is interposed and pressed between the upper die 4 and the lower die 3 with pressure from the movable stage 5 applied to the upper die 4 via a second elastic member 8 from a pressure plate 7 of the pressure adjusting device 6, with the stopper 10 restricting the bottom dead point position of the upper die 4.
Inventors:
KITAZUMI SHINICHI (JP)
IKEURA RYOJUN (JP)
IKEURA RYOJUN (JP)
Application Number:
PCT/JP2021/029067
Publication Date:
February 10, 2022
Filing Date:
August 05, 2021
Export Citation:
Assignee:
ICHISHI SEIKOU DENKI LTD (JP)
UNIV MIE (JP)
UNIV MIE (JP)
International Classes:
B21D37/12; B21D53/00; B30B15/02
Foreign References:
| JP2005329468A | 2005-12-02 | |||
| JP2018153826A | 2018-10-04 | |||
| JP2002192244A | 2002-07-10 | |||
| JP2016000431A | 2016-01-07 |
Attorney, Agent or Firm:
WAKI, Hikaru et al. (JP)
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