Title:
DIE AND SURFACE TREATING METHOD FOR DIE
Document Type and Number:
WIPO Patent Application WO/2000/006332
Kind Code:
A1
Abstract:
A surface treating method for a die, wherein electrode consumable melted substance of a discharge electrode produced by a discharge energy by means of electro-hydraulic machining or its reactant is bonded to and deposited on the cutting edge side face (104) of a stamping die or the inner peripheral surface of a die hole of an extracting/extruding die to form a hard coating (108) consisting of the electrode consumable melted substance or its reactant on the cutting edge side face or the die hole inner peripheral surface and the hard coating (108) is finished by discharge machining or grinding, thereby providing a die which is equivalent or superior in service life to a cemented carbide die and high in precision even when a tool steel is used as its base metal.
Inventors:
MORO TOSHIO (JP)
GOTO AKIHIRO (JP)
GOTO AKIHIRO (JP)
Application Number:
PCT/JP1999/002215
Publication Date:
February 10, 2000
Filing Date:
April 26, 1999
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MORO TOSHIO (JP)
GOTO AKIHIRO (JP)
MORO TOSHIO (JP)
GOTO AKIHIRO (JP)
International Classes:
C23C14/32; (IPC1-7): B23H9/00
Foreign References:
| JPH08300227A | 1996-11-19 | |||
| JPH09192937A | 1997-07-29 | |||
| JPH0919829A | 1997-01-21 | |||
| JPS53137010A | 1978-11-30 | |||
| JPH08243843A | 1996-09-24 | |||
| JPH05148615A | 1993-06-15 | |||
| JPH06182626A | 1994-07-05 |
Attorney, Agent or Firm:
Sakai, Hiroaki (Kasumigaseki 3-chome Chiyoda-ku Tokyo, JP)
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