Title:
DIE TAKING-OUT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/083185
Kind Code:
A1
Abstract:
Provided is a die taking-out method, comprising the following steps: removing solder balls from the back face of a sample; attaching the back face of the sample to a grinding jig, and flattening the sample by means of a flattening device; grinding the front face of the sample, removing the part located on the front face of a target die, and retaining the part of a layer of bonding film located on the front face of the target die and leads located in the part; attaching the front face of the sample to the grinding jig, and flattening the sample by means of the flattening device; grinding the back face of the sample, removing the part located on the back face of the target die, and retaining a layer of bonding film located on the back face of the target die; removing a bonding film and the remaining packaging materials on the sample to obtain the target die; and attaching the back face of the target die to a glass slide, thereby completing the taking out of the target die.
Inventors:
WANG KUN (CN)
Application Number:
PCT/CN2021/106332
Publication Date:
April 28, 2022
Filing Date:
July 14, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G01R31/26; H01L21/02
Foreign References:
| CN106338684A | 2017-01-18 | |||
| CN104422606A | 2015-03-18 | |||
| CN1471141A | 2004-01-28 | |||
| CN104465315A | 2015-03-25 | |||
| CN105842611A | 2016-08-10 | |||
| EP1548450A2 | 2005-06-29 |
Attorney, Agent or Firm:
BEIJING LINKAW PATENT ATTORNEY LAW FIRM (CN)
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