DIELECTRIC FORMING SHEET AND PROCESS FOR PRODUCING DIELECTRIC LAYER PROVIDED SUBSTRATE

WIPO Patent Application WO/2006/098075

A1

A dielectric forming sheet that is used to form a dielectric layer capable of avoiding any generation of air bubbles beside an electrode on a glass substrate. It is also intended to provide a transfer sheet, a process for producing a dielectric layer provided substrate, a dielectric layer provided substrate and a plasma display panel. There is provided a dielectric forming sheet comprising a film forming material layer wherein the volume ratio between inorganic powder and organic component, organic component/inorganic powder, is in the range of 0.05 to 0.6, the film forming material layer on its one major surface side overlaid with a viscoelastic layer.

BANBA TOMOHIDE (JP)
KUME KATSUYA (JP)
KAI MAKOTO (JP)
BUZOUJIMA YASUSHI (JP)
HATANAKA ITSUHIRO (JP)
SUZUKI HIDENORI (JP)
KONISHI TOSHIHARU (JP)

PCT/JP2006/300433

September 21, 2006

January 16, 2006

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NITTO DENKO CORP (JP)
BANBA TOMOHIDE (JP)
KUME KATSUYA (JP)
KAI MAKOTO (JP)
BUZOUJIMA YASUSHI (JP)
HATANAKA ITSUHIRO (JP)
SUZUKI HIDENORI (JP)
KONISHI TOSHIHARU (JP)

H01B17/60; B32B7/02; B32B17/06; C03C17/04; H01B3/00; H01J9/02; H01J11/02; H01J11/22; H01J11/34; H01J11/38

JP2004022297A	2004-01-22
JP2003270783A	2003-09-25
JP2002163928A	2002-06-07
JP2001328836A	2001-11-27
JP2001294445A	2001-10-23
JPH03297009A	1991-12-27
JP2004063420A	2004-02-26
JP2004362939A	2004-12-24
JPH10101373A	1998-04-21
JPH10326560A	1998-12-08
JP2000173456A	2000-06-23

Suzuki, Takao (13-9 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka, JP)

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