DIELECTRIC-HEATING BONDING FILM AND JOINING METHOD USING DIELECTRIC-HEATING BONDING FILM

Title:

DIELECTRIC-HEATING BONDING FILM AND JOINING METHOD USING DIELECTRIC-HEATING BONDING FILM

Document Type and Number:

WIPO Patent Application WO/2018/079354

Kind Code:

A1

Abstract:

Provided are: a dielectric-heating bonding film that makes it possible to achieve secure joining in a relatively short time when a dielectric heating treatment is performed on adherends such as polyolefin resins; and a joining method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that is for joining a plurality of adherends that comprise the same or different materials by means of a dielectric heating treatment. The dielectric-heating bonding film is characterized: by containing (A) a polyolefin resin and (B) a dielectric filler that has an average particle size of 1–30 μm as measured in conformity with JIS Z 8819-2 (2001); and by having a thickness of 10–2,000 μm. A joining method that uses the dielectric-heating bonding film.

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Inventors:

ISHIKAWA MASAKAZU (JP)
IZUMI TATSUYA (JP)

Application Number:

PCT/JP2017/037616

Publication Date:

May 03, 2018

Filing Date:

October 18, 2017

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

C09J7/00; B29C65/04; B29C65/40; C09J11/04; C09J123/00; C09J123/10; H05B6/46; H05B6/64

Foreign References:

JP2009538971A	2009-11-12
JPS58174474A	1983-10-13
JPH0872055A	1996-03-19
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JPH0967461A	1997-03-11
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JPH08258173A	1996-10-08
JP2014037489A	2014-02-27
JPH11157398A	1999-06-15
JP2003238745A	2003-08-27
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Other References: