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Patent Searching and Data


Title:
DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2018/079356
Kind Code:
A1
Abstract:
Provided are: a dielectric-heating bonding film that can achieve secure bonding even when a dielectric heating treatment is short; and a bonding method that uses the dielectric-heating bonding film. A dielectric-heating bonding film that is for bonding a pair of adherends that comprise the same or different materials by means of a dielectric heating treatment. The dielectric-heating bonding film contains a thermoplastic resin as an A component and a dielectric filler as a B component and satisfies conditions (i) and (ii). (i) The melting point or softening point of the dielectric-heating bonding film as measured in compliance with a method prescribed by JIS K 7121 (1987) is within the range of 80℃–200℃. (ii) The heat of fusion of the dielectric-heating bonding film as measured in accordance with JIS K 7121 (1987) is in the range of 1–80 J/g.

Inventors:
ISHIKAWA MASAKAZU (JP)
Application Number:
PCT/JP2017/037618
Publication Date:
May 03, 2018
Filing Date:
October 18, 2017
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/00; B29C65/04; B29C65/50; C09J11/04; C09J123/00; C09J123/10; C09J125/04; C09J177/00; C09J201/00; H05B6/46; H05B6/64
Foreign References:
JP2000289113A2000-10-17
JPH08258173A1996-10-08
JPS58174474A1983-10-13
JPH0872055A1996-03-19
JP2001146524A2001-05-29
JP2001226533A2001-08-21
JP2015151493A2015-08-24
JPH11157398A1999-06-15
JP2003238745A2003-08-27
JP2014037489A2014-02-27
JP2010006908A2010-01-14
JP2008156510A2008-07-10
JP2003238745A2003-08-27
JP2003193009A2003-07-09
JP2014037489A2014-02-27
JP2009126922A2009-06-11
Other References:
See also references of EP 3533848A4
Attorney, Agent or Firm:
EMORI Kenji (JP)
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