Title:
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, AND THE SUBASSEMBLIES FORMED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2010/144792
Kind Code:
A9
Abstract:
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about (15) to about (65) volume percent of a dielectric filler; and about (35) to about (85) volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
Inventors:
PAUL SANKAR K (US)
KENNEDY SCOTT D (US)
BAARS DIRK M (US)
KENNEDY SCOTT D (US)
BAARS DIRK M (US)
Application Number:
PCT/US2010/038303
Publication Date:
April 14, 2011
Filing Date:
June 11, 2010
Export Citation:
Assignee:
ROGERS CORP (US)
PAUL SANKAR K (US)
KENNEDY SCOTT D (US)
BAARS DIRK M (US)
PAUL SANKAR K (US)
KENNEDY SCOTT D (US)
BAARS DIRK M (US)
International Classes:
B05D7/16; C08J5/18; C08K3/00; C08K3/22; C08K3/36; C08L15/00; C08L71/12; C09J171/12; H05K1/03; H05K3/38
Attorney, Agent or Firm:
KONKOL, Chris P. (20 Church Street22nd Floo, Hartford Connecticut, US)
Download PDF:
Previous Patent: SIDE CURTAIN AIRBAG
Next Patent: FAULT DETECTION AND MITIGATION IN HYBRID DRIVE SYSTEM
Next Patent: FAULT DETECTION AND MITIGATION IN HYBRID DRIVE SYSTEM