Title:
DIELECTRIC PASTE FOR SPACER LAYER OF MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2005/056673
Kind Code:
A1
Abstract:
Disclosed is a dielectric paste for spacer layers of multilayer ceramic electronic components which does not dissolve a binder contained in a layer adjoining to a spacer layer in a multilayer ceramic electronic component and thus is capable of effectively preventing occurrence of defects in the multilayer ceramic electronic component. The dielectric paste for spacer layers contains a butyral resin as a binder, and also contains at least one solvent selected from the group consisting of dihydroterpinyl oxyethanol, terpinyl oxyethanol, d-dihydrocarveol, I-citroneol, I-perillyl alcohol and acetoxy-methoxyethoxy-cyclohexanol acetate.
Inventors:
SATOU SHIGEKI (JP)
NOMURA TAKESHI (JP)
NOMURA TAKESHI (JP)
Application Number:
PCT/JP2004/018627
Publication Date:
June 23, 2005
Filing Date:
December 14, 2004
Export Citation:
Assignee:
TDK CORP (JP)
SATOU SHIGEKI (JP)
NOMURA TAKESHI (JP)
SATOU SHIGEKI (JP)
NOMURA TAKESHI (JP)
International Classes:
C08L29/14; C08K5/04; C08K5/06; C08K5/101; C08L29/04; C09D129/14; H01B1/22; H01B3/00; H01G4/002; H01G4/008; H01G4/12; H01G4/30; (IPC1-7): C08L29/04; C08K5/04; H01B3/00; H01G4/12; H01G4/30
Foreign References:
| JPH08111346A | 1996-04-30 | |||
| JP2001172594A | 2001-06-26 | |||
| JPH0721833A | 1995-01-24 | |||
| JPH06206756A | 1994-07-26 |
Attorney, Agent or Firm:
Oishi, Koichi (Yusen-Awajicho Building 4-1, Kandaawajicho 1-chom, Chiyoda-ku Tokyo, JP)
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