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Title:
DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITORS, AND FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2013/057987
Kind Code:
A1
Abstract:
Provided is a dielectric resin composition for film capacitors that have high withstand voltage, high heat resistance and low dielectric loss. This dielectric resin composition for film capacitors is a mixture which contains an organic material (A) and an organic material (B). The organic material (A) is configured of at least two organic material components (A1, A2) which respectively have a reactive group (for example, OH or NCO) crosslinkable with each other. The organic material (B) does not have a reactive moiety that is reactive with the organic material (A) and has a dielectric loss (tanδ) at 125˚C of 0.3% or less. It is preferable that both of the organic material (A) and the organic material (B) have an aromatic ring (R). The glass transition temperature of the mixture is 130˚C or more, and preferably 280˚C or less. This dielectric resin composition is capable of increasing heat resistance and dielectric breakdown strength, and is also capable of decreasing dielectric loss.

Inventors:
ICHIKAWA TOMOMICHI (JP)
YOSHIKAWA NORIHIRO (JP)
NAKAMURA ICHIRO (JP)
KOBAYASHI SHINICHI (JP)
NAKASO ICHIRO (JP)
HIOKI YASUNORI (JP)
INAKURA TOMOKI (JP)
Application Number:
PCT/JP2012/068031
Publication Date:
April 25, 2013
Filing Date:
July 16, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
ICHIKAWA TOMOMICHI (JP)
YOSHIKAWA NORIHIRO (JP)
NAKAMURA ICHIRO (JP)
KOBAYASHI SHINICHI (JP)
NAKASO ICHIRO (JP)
HIOKI YASUNORI (JP)
INAKURA TOMOKI (JP)
International Classes:
H01G4/18; C08L29/14; C08L67/03; C08L69/00; C08L71/12; C08L81/06
Domestic Patent References:
WO2010114087A12010-10-07
WO2010101170A12010-09-10
WO2010101170A12010-09-10
Foreign References:
JP2008229849A2008-10-02
JP2010192787A2010-09-02
JP2003160718A2003-06-06
JPH10119127A1998-05-12
JP2010087507A2010-04-15
Other References:
See also references of EP 2770516A4
Attorney, Agent or Firm:
KOSHIBA, MASAAKI (JP)
Masaaki Koshiba (JP)
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Claims: