DIELECTRIC RESIN COMPOSITION FOR USE IN FILM CONDENSER, AND FILM CONDENSER

WIPO Patent Application WO/2010/114087

A1

In order to increase the heat resistance of a film condenser, as a material of a dielectric resin film for use in the film condenser, a dielectric resin composition, which provides a cured material by mixing two or more kinds of organic materials including at least first and second organic materials (11) and (12) having functional groups (16) and (18) reacted with each other, respectively, and cross-linking the organic materials to each other, is used. The end of a side chain (15) of the first organic material (11) has a molecular cohesive energy larger than that of a methyl group and has a highly cohesive atomic group (17) capable of cohering with the other atom group due to the molecular cohesive energy, and the highly cohesive atomic groups (17) form a coherent moiety (20) serving as a pseudo-crosslinkage.

ICHIKAWA TOMOMICHI (JP)
HIOKI YASUNORI (JP)
YOSHIKAWA NORIHIRO (JP)
NAKAMURA ICHIRO (JP)
KOBAYASHI SHINICHI (JP)
NAKASO ICHIRO (JP)

PCT/JP2010/056001

October 07, 2010

April 01, 2010

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MURATA MANUFACTURING CO (JP)
ICHIKAWA TOMOMICHI (JP)
HIOKI YASUNORI (JP)
YOSHIKAWA NORIHIRO (JP)
NAKAMURA ICHIRO (JP)
KOBAYASHI SHINICHI (JP)
NAKASO ICHIRO (JP)

C08L29/14; C08J5/18; H01G4/18

WO2006100833A1	2006-09-28
WO2006100833A1	2006-09-28

JP2008229849A	2008-10-02
JPH10119127A	1998-05-12
JP2002327065A	2002-11-15

See also references of EP 2415834A4
"Kagaku Binran Ouyo Hen", 1973

KOSHIBA, MASAAKI (JP)
Masaaki Koshiba (JP)

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