DIEPOXY COMPOUND, MANUFACTURING METHOD THEREFOR, AND COMPOSITION CONTAINING SAID DIEPOXY COMPOUND

Title:

DIEPOXY COMPOUND, MANUFACTURING METHOD THEREFOR, AND COMPOSITION CONTAINING SAID DIEPOXY COMPOUND

Document Type and Number:

WIPO Patent Application WO/2011/118368

Kind Code:

A1

Abstract:

Disclosed is a diepoxy compound represented by formula (1) (in which R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom or a C1-3 alkyl group).

Inventors:

ASAUMI TAKU (JP)
ITAGAKI MAKOTO (JP)

Application Number:

PCT/JP2011/055164

Publication Date:

September 29, 2011

Filing Date:

February 28, 2011

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Assignee:

SUMITOMO CHEMICAL CO (JP)
ASAUMI TAKU (JP)
ITAGAKI MAKOTO (JP)

International Classes:

C07D303/27; C07D301/28; C08G59/02

Foreign References:

JPH02240128A	1990-09-25
JPH0284432A	1990-03-26
JP2002037851A	2002-02-06
JPH0841164A	1996-02-13

Other References:

GIAMBERINI, M. ET AL.: "Lightly crosslinked liquid-crystalline epoxy resins. The effect of rigid-rod length and applied stress on the state of order of the cured thermoset", MACROMOLECULAR CHEMISTRY AND PHYSICS, vol. 198, no. 10, 1997, pages 3185 - 3196, XP000727218, DOI: doi:10.1002/macp.1997.021981016
GIAMBERINI, M. ET AL.: "Liquid crystalline epoxy thermosets", MOLECULAR CRYSTALS AND LIQUID CRYSTALS, vol. 266, 1995, pages 9 - 22
THREE BOND TECHNICAL NEWS, vol. 32, 1990
SOSETSU EPOXY JUSHI OYO HEN I, 2003, pages 134 - 135, 211-212
SOSETSU EPOXY JUSHI KISO HEN II, 2003, pages 218
SOSETSU EPOXY JUSHI KISO HEN I, 2003, pages 307 - 310

Attorney, Agent or Firm:

NAKAYAMA, Tohru et al. (JP)
Nakayama 亨 (JP)

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