Title:
DIES AND CRIMPING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/008524
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide dies and a crimping method, wherein, when caulking a signal conductor of a wire placed on a terminal forming piece so as to wrap around the signal conductor, the signal conductor can be made not to bulge out from in-between both ends of the terminal forming piece. An upper die (18) of the present invention comprises a bulging-out preventing protrusion (17) that protrudes towards a signal conductor (14) arranged on the upper side of a terminal forming piece (12) placed on a lower die (19); and inner-die wall faces (18a) that are positioned at both sides of the bulging-out preventing protrusion (17), and that are for bending the terminal forming piece (12). When crimping the terminal forming piece (12) onto the signal conductor (14) with the upper die (18) and the lower die (19), the bulging-out preventing protrusion (17) presses the signal conductor (14) in the downward direction, and the inner-die wall faces (18a) bend the terminal forming piece (12) such that both end-sections of the terminal forming piece (12) will come near the bulging-out preventing protrusion (17).
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Inventors:
MORIKAWA Taishi (())
Application Number:
JP2011/066083
Publication Date:
January 19, 2012
Filing Date:
July 14, 2011
Export Citation:
Assignee:
YAZAKI CORPORATION (4-28, Mita 1-chome Minato-k, Tokyo 33, 〒1088333, JP)
矢崎総業株式会社 (〒33 東京都港区三田１丁目４番２８号 Tokyo, 〒1088333, JP)
矢崎総業株式会社 (〒33 東京都港区三田１丁目４番２８号 Tokyo, 〒1088333, JP)
International Classes:
H01R43/048; B21D39/00; H01R4/18
Attorney, Agent or Firm:
HONDA Hironori et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims:
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