Title:
DIFFERENTIAL CAPACITIVE MEMS MICROPHONE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/185445
Kind Code:
A1
Abstract:
The present application relates to a differential capacitive MEMS microphone and a manufacturing method therefor. The microphone comprises: a substrate (110) comprising a second backplane (112); a first support layer (124) provided on the substrate (110); a diaphragm (122) provided on the first support layer (124); a second support layer (126) provided on the diaphragm (122); and a first backplane (132) provided on the second support layer (126), the diaphragm (122) being located between the first backplane (132) and the second backplane (112), wherein a first capacitor formed by the diaphragm (122) and the first backplane (132) is used for outputting a first capacitance value signal, a second capacitor formed by the diaphragm (122) and the second backplane (112) is used for outputting a second capacitance value signal, and the first capacitance value signal and the second capacitance value signal form a differential signal. According to the present application, a part of the structure of the substrate is used as the second backplane, and therefore, the second backplane does not lead to an increase in thickness of the microphone. Moreover, the capacitance signals output by the capacitors formed by the diaphragm together with the first backplane and with the second backplane form a differential signal, so that the signal-to-noise ratio of the microphone can be improved.
Inventors:
FENG DONG (CN)
Application Number:
PCT/CN2023/081276
Publication Date:
October 05, 2023
Filing Date:
March 14, 2023
Export Citation:
Assignee:
CSMC TECHNOLOGIES FAB2 CO LTD (CN)
International Classes:
H04R19/04; H04R31/00
Foreign References:
| CN107360526A | 2017-11-17 | |||
| CN215935098U | 2022-03-01 | |||
| CN112672262A | 2021-04-16 | |||
| JP2002223499A | 2002-08-09 | |||
| CN104113810A | 2014-10-22 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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