Title:
DIFFERENTIAL PRESSURE SENSOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/206981
Kind Code:
A1
Abstract:
A differential pressure sensor package structure and an electronic device. The differential pressure sensor package structure comprises: a substrate (11) and a housing (1), the edge of the housing (1) being fixed on the front surface of the substrate (11), and a first cavity (6) being formed between the housing (1) and the substrate (11); and a pressure sensing element (2) fixed on the front surface of the substrate (11) and located in the first cavity (6), the pressure sensing element (2) having a second cavity (10) and a pressing sensing layer (201), and the pressure sensing layer (201) being located between the first cavity (6) and the second cavity (10). The first cavity (6) is communicated with the outside by means of a first through hole (4, 4a, 4b), and the second cavity (10) is communicated with the outside by means of a second through hole (9). The differential pressure sensor has a relatively small size, relatively low power consumption, and high reliability.
Inventors:
LI GANG (CN)
MEI JIAXIN (CN)
SHAO CHENGLONG (CN)
MEI JIAXIN (CN)
SHAO CHENGLONG (CN)
Application Number:
PCT/CN2019/112935
Publication Date:
October 15, 2020
Filing Date:
October 24, 2019
Export Citation:
Assignee:
MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD (CN)
International Classes:
G01L13/00; G01L13/06
Foreign References:
| CN110082027A | 2019-08-02 | |||
| CN109827703A | 2019-05-31 | |||
| CN206538189U | 2017-10-03 | |||
| CN204612856U | 2015-09-02 | |||
| CN107991016A | 2018-05-04 | |||
| CN108072487A | 2018-05-25 | |||
| US10065853B2 | 2018-09-04 |
Attorney, Agent or Firm:
SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)
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