Title:
DIFFUSION-BONDED BODY WELDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/139327
Kind Code:
A1
Abstract:
Provided is a diffusion-bonded body welding method for bonding, by fusion welding, a diffusion-bonded body (10) formed by diffusion-bonding of metal members (12), and another member (16). The welding method comprises: a buffer layer forming step in which, in a welding region including a diffusion-bonded section (14) of the diffusion-bonded body (10), a buffer layer (20) having greater ductility than the diffusion-bonded section (14) is formed; and a welding step in which the welding region where the buffer layer (20) is formed and the other member (16) are bonded by fusion welding from above the buffer layer (20).
Inventors:
MASAKI KUNITAKA (JP)
HARADA RIE (JP)
HOSOYA NAGISA (JP)
MATSUOKA TAKAAKI (JP)
MIZO YUTAKA (JP)
HARADA RIE (JP)
HOSOYA NAGISA (JP)
MATSUOKA TAKAAKI (JP)
MIZO YUTAKA (JP)
Application Number:
PCT/JP2018/001338
Publication Date:
August 02, 2018
Filing Date:
January 18, 2018
Export Citation:
Assignee:
IHI CORP (JP)
International Classes:
B23K9/23; B23K9/04; B23K20/00
Foreign References:
| JP2010234419A | 2010-10-21 | |||
| JPS5623392A | 1981-03-05 | |||
| JPS6149789A | 1986-03-11 |
Other References:
NUCLEAR ENGINEERING AND DESIGN, vol. 249, 2012, pages 49 - 56
See also references of EP 3575027A4
See also references of EP 3575027A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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