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Patent Searching and Data


Title:
DIFFUSION-BONDED HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2020/105658
Kind Code:
A1
Abstract:
One purpose of this invention is to provide a diffusion-bonded heat exchanger that makes it possible to reduce the thermal stress which occurs in association with heat exchange between fluids having a large temperature difference, even if a large number of heat exchanger plates have been stacked. This diffusion-bonded heat exchanger (100) is provided with a core (1) in which a plurality of heat exchanger plates (HP) have been stacked and diffusion-bonded. The core includes: a plurality of flow channel blocks (40) configured to each include a plurality of flow channel layers (30); and a partition wall layer (50) demarcating between the plurality of flow channel blocks. The thickness (t3) of the partition wall layer in the direction of stacking is greater than the interval (t2) between flow channels that are side by side in the direction of stacking.

Inventors:
TAKAHASHI SUGURU (JP)
FUJITA YASUHIRO (JP)
Application Number:
JP2019/045353
Publication Date:
May 28, 2020
Filing Date:
November 20, 2019
Export Citation:
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Assignee:
SUMITOMO PRECISION PROD CO (JP)
International Classes:
F28F3/08; B23K20/00; F28D9/02; F28F3/12
Foreign References:
US20150316326A12015-11-05
JPH04161796A1992-06-05
KR101376531B12014-03-19
JP2008039255A2008-02-21
JP2014152963A2014-08-25
JP2005180806A2005-07-07
JP2015114080A2015-06-22
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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