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Title:
DIFFUSION-JOINED TARGET ASSEMBLY OF HIGH-PURITY COBALT TARGET AND COPPER ALLOY BACKING PLATE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2002/029130
Kind Code:
A1
Abstract:
A diffusion-joined target assembly comprising a high-purity cobalt target and a copper alloy backing plate that are diffusion-joined by using as an insert material an aluminum or aluminum alloy sheet at least 5 mm thick, wherein an effective sputtering of a high-purity cobalt ferromagnetic target is permitted, and a warp or separation can be prevented when the target is joined with the backing plate or under a rigorous condition of high-power sputtering; and a production method therefor.

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Inventors:
TAKAHASHI KAZUSHIGE (JP)
MIYASHITA HIROHITO (JP)
Application Number:
PCT/JP2001/005902
Publication Date:
April 11, 2002
Filing Date:
July 06, 2001
Export Citation:
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Assignee:
NIKKO MATERIALS CO LTD (JP)
TAKAHASHI KAZUSHIGE (JP)
MIYASHITA HIROHITO (JP)
International Classes:
B23K20/00; B23K20/16; C23C14/34; G11B5/85; H01F41/18; B23K103/12; (IPC1-7): C23C14/34
Foreign References:
JP2000239837A2000-09-05
JPH11236665A1999-08-31
US6071389A2000-06-06
Attorney, Agent or Firm:
Ogoshi, Isamu (Atago 1-chome Minato-ku, Tokyo, JP)
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