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Patent Searching and Data


Title:
DIMENSION MEASURING METHOD USING AUGMENTED REALITY
Document Type and Number:
WIPO Patent Application WO/2023/135697
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a dimension measuring method using augmented reality, the method enabling fast and accurate measurement by quickly guiding a gauge to a measurement point. An augmented reality space is generated by processing an image captured by a camera (93) with a processing unit (97), and displaying the processed image on a transmissive screen (14). In a virtual space, one virtual measurement point (Ib1n) corresponding to one real measurement point (Rb1n), another virtual measurement point (Ib2n) corresponding to another real measurement point (Rb2n), a virtual first probe (63a) corresponding to a first probe (53a) in a real space, and a virtual second probe (63b) corresponding to a second probe (53b) in the real space are displayed. The measurement method includes a first step for determining that the virtual first probe (63a) comes into contact with the one virtual measurement point (Ib1n), and a second step for determining that the virtual second probe (63b) comes into contact with the another virtual measurement point (Ib2n).

Inventors:
YANG NA (JP)
TANIDA YUTA (JP)
OHYAMA TAKUMA (JP)
YAMAGUCHI GOJIRO (JP)
Application Number:
PCT/JP2022/000856
Publication Date:
July 20, 2023
Filing Date:
January 13, 2022
Export Citation:
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Assignee:
HITACHI LTD (JP)
ARDE CO LTD (JP)
International Classes:
G01B5/02; G06T19/00
Foreign References:
JP2006277350A2006-10-12
JP2017167863A2017-09-21
US20150347849A12015-12-03
JP2013104747A2013-05-30
JP2020071065A2020-05-07
Attorney, Agent or Firm:
DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)
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