Title:
DIMPLED WORKPIECE AND DIMPLING PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/202911
Kind Code:
A1
Abstract:
A plurality of dimples (3) are formed in a processing surface (2) of a workpiece 1. For the dimples (3) the aspect ratio of the vertical length (3b) in the longitudinal direction and the lateral length (3c) in the lateral direction orthogonal to the longitudinal direction is 5.0 to 50.0.
Inventors:
NISHIO SATORU (JP)
NIIMI TATSUYA (JP)
SATO TOSHIKI (JP)
KANDA YASUYUKI (JP)
NIIMI TATSUYA (JP)
SATO TOSHIKI (JP)
KANDA YASUYUKI (JP)
Application Number:
PCT/JP2019/012111
Publication Date:
October 24, 2019
Filing Date:
March 22, 2019
Export Citation:
Assignee:
KANEFUSA KNIFE & SAW (JP)
International Classes:
F16C33/10; B23C3/00; B23C5/10; B23C5/12
Domestic Patent References:
WO2010137521A1 | 2010-12-02 | |||
WO2017002326A1 | 2017-01-05 | |||
WO2017199911A1 | 2017-11-23 |
Foreign References:
JP2007211405A | 2007-08-23 | |||
JP2003343741A | 2003-12-03 | |||
JPH1052998A | 1998-02-24 |
Other References:
See also references of EP 3783239A4
Attorney, Agent or Firm:
OKADA PATENT & TRADEMARK OFFICE, P. C. (JP)
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