Title:
DIP-MOLDED ARTICLE AND COMPOSITION FOR DIP-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2007/049689
Kind Code:
A1
Abstract:
Disclosed is a dip-molded article produced by: dipping a mold for dip molding in a dip-molding composition, wherein the dip-molding composition comprises a conjugated diene rubber latex and a water-insoluble organic peroxide and the mold has an activator for the organic peroxide and a coagulant both adhered on its surface; removing the mold from the composition; and heating the composition-dipped mold to induce the cross-linking of the conjugated diene rubber. Also disclosed is a dip-molded article produced substantially in the same manner as described above, except that the activator is added to the conjugated diene latex instead of being adhered on the surface of the mold. These dip-molded articles are free from sulfur odor and are excellent in tensile strength and bending fatigue resistance.
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Inventors:
KODAMA, Kazumi (6-2 Marunouchi 1-chome, Chiyoda-k, Tokyo 46, 1008246, JP)
Application Number:
JP2006/321360
Publication Date:
May 03, 2007
Filing Date:
October 26, 2006
Export Citation:
Assignee:
ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 46, 1008246, JP)
日本ゼオン株式会社 (〒46 東京都千代田区丸の内一丁目６番２号 Tokyo, 1008246, JP)
日本ゼオン株式会社 (〒46 東京都千代田区丸の内一丁目６番２号 Tokyo, 1008246, JP)
International Classes:
B29C41/14; A41D19/00; C08J5/02; C08K5/14; C08K5/17; C08L9/10; B29K9/00; B29L31/48
Attorney, Agent or Firm:
UCHIDA, Yukio (Uchida & Associates, Sunny Port Shiba 1005 5-10, Shiba 2-chome, Minato-k, Tokyo 14, 1050014, JP)
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