Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY
Document Type and Number:
WIPO Patent Application WO/2014/110480
Kind Code:
A3
Abstract:
A diplexer (200, 240) includes a substrate (242) having a set of through substrate vias. The diplexer also includes a first set of traces (206, 226, 228) on a first surface of the substrate. The first traces are coupled to the through substrate vias (224). The diplexer further includes a second set of traces (228) on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor (210, 212, 214, 230) supported by the substrate.

Inventors:
ZUO, Chengjie (5775 Morehouse Drive, San Diego, California, 92121, US)
KIM, Jonghae (5775 Morehouse Drive, San Diego, California, 92121, US)
VELEZ, Mario Francisco (5775 Morehouse Drive, San Diego, California, 92121, US)
LAN, Je-Hsiung (5775 Morehouse Drive, San Diego, California, 92121, US)
KIM, Daeik (5775 Morehouse Drive, San Diego, California, 92121, US)
YUN, Changhan (5775 Morehouse Drive, San Diego, California, 92121, US)
BERDY, David F (5775 Morehouse Drive, San Diego, California, 92121, US)
MIKULKA, Robert P. (5775 Morehouse Drive, San Diego, California, 92121, US)
NORWAK, Matthew M. (5775 Morehouse Drive, San Diego, California, 92121, US)
ZHANG, Xiangdong (5775 Morehouse Drive, San Diego, California, 92121, US)
SEE, Puay H (5775 Morehouse Drive, San Diego, California, 92121, US)
Application Number:
US2014/011223
Publication Date:
September 04, 2014
Filing Date:
January 13, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
QUALCOMM INCORPORATED (Attn: International IP Administration, 5775 Morehouse DriveSan Diego, California, 92121, US)
International Classes:
H03H7/46; H01F17/00; H01L23/15; H01L23/498; H01L23/64; H03H1/00; H05K1/16
Domestic Patent References:
WO2009118694A12009-10-01
Foreign References:
US5696471A1997-12-09
US20090225525A12009-09-10
JP2003100553A2003-04-04
JPS5291446U1977-07-08
US20040124961A12004-07-01
US20110095395A12011-04-28
US20130207745A12013-08-15
Other References:
METHOT F: "CONSTANT IMPEDANCE BANDPASS AND DIPLEXER FILTERS", RF DESIGN, PRIMEDIA BUSINESS MAGAZINES & MEDIA, vol. 9, no. 11, November 1986 (1986-11-01), XP001086415
WOLFGANG A VITALE ET AL: "High-Q 3D embedded inductors using TSV for RF MEMS tunable bandpass filters (4.65 6.8 GHz)", IEEE EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, 29 October 2012 (2012-10-29), pages 822 - 825, XP032345713
SERGIY SAKHNENKO ET AL: "Ultra-low-profile small-size LTCC front-end module (FEM) for WLAN applications based on a novel diplexer design approach", MICROWAVE SYMPOSIUM DIGEST, 2009. MTT '09. IEEE MTT-S INTERNATIONAL, IEEE, PISCATAWAY, NJ, USA, 7 June 2009 (2009-06-07), pages 609 - 612, XP031490592, ISBN: 978-1-4244-2803-8
Attorney, Agent or Firm:
TALPALATSKY, Sam (5775 Morehouse Drive, San Diego, California, 92121, US)
Download PDF: