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Title:
DIRECT-WRITE PLASMA SPRAYING TECHNOLOGY APPLIED TO SEMICONDUCTOR INDUSTRY
Document Type and Number:
WIPO Patent Application WO/2019/237613
Kind Code:
A1
Abstract:
A direct-write plasma spraying technology applied to the semiconductor industry, comprising: (1) spraying a first functional coating (A1) according to the requirement of a semiconductor part; (2) spraying a small-area second coating (A2) on the first coating (A1), the second coating (A2) needing to be obviously different from the first functional coating (A1) in a certain property; (3) spraying, on the second coating (A2), a third coating (A3) having the same material as the first coating (A1), the thickness of the third coating (A3) being slightly less than that of the first coating (A1); and (4) spraying wireless on the third coating (A3), so as to connect to an external monitoring device. According to the method, the change of the third coating (A3) is monitored by a sensor consisting of the first coating (A1), the second coating (A2), and the third coating (A3), so as to replace the part when the life of the first coating (A1) reaches the limit.

Inventors:
XU JUNYANG (CN)
LEE JIA (CN)
SHAO YING (CN)
Application Number:
PCT/CN2018/110325
Publication Date:
December 19, 2019
Filing Date:
October 16, 2018
Export Citation:
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Assignee:
SHENYANG FORTUNE PREC EQUIPMENT CO LTD (CN)
International Classes:
H01L21/02
Foreign References:
CN102456564A2012-05-16
CN107073651A2017-08-18
CN103132003A2013-06-05
US20020118027A12002-08-29
US20130115418A12013-05-09
Attorney, Agent or Firm:
SHENYANG UPDATE INTELLECTUAL PROPERTY AGENCY (CN)
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