Title:
DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/018537
Kind Code:
A1
Abstract:
An inspecting device and method for inspecting a processed region formed on the
surface of a disc wafer such as a semiconductor wafer with higher accuracy. The
inspecting device comprises imaging means (130a, 130b) for imaging the periphery
and its neighboring region of a rotating wafer, wafer periphery position measuring
means (200) for measuring the radial position of the periphery at each of the rotation
angle positions θn of the wafer from the images captured by the imaging
means (130a, 130b), periphery-to-periphery distance measuring means (200)
for measuring the periphery-to-periphery distance Bθn between
the periphery of the wafer and that of an insulating film at each of the rotation
angle positions θn with reference to the captured images, and inspection
information creating means (200) for creating predetermined inspection information
from the radial position Aθn of the periphery of the wafer and
the periphery-to-periphery distance Bθn.
Inventors:
HAYASHI, Yoshinori (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
林 義典 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
KOGAWA, Takeki (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
古川 長樹 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
林 義典 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
KOGAWA, Takeki (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
古川 長樹 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
Application Number:
JP2007/065597
Publication Date:
February 14, 2008
Filing Date:
August 09, 2007
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORPORATION (2-5-1, Kasama Sakae-ku, Yokohama-sh, Kanagawa 10, 2478610, JP)
芝浦メカトロニクス株式会社 (〒10 神奈川県横浜市栄区笠間二丁目５番１号 Kanagawa, 2478610, JP)
HAYASHI, Yoshinori (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
林 義典 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
KOGAWA, Takeki (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
芝浦メカトロニクス株式会社 (〒10 神奈川県横浜市栄区笠間二丁目５番１号 Kanagawa, 2478610, JP)
HAYASHI, Yoshinori (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
林 義典 (〒60 神奈川県横浜市栄区笠間二丁目５番１号 芝浦メカトロニクス株式会社 横浜事業所内 Kanagawa, 2478560, JP)
KOGAWA, Takeki (YOKOHAMA OPERATIONS 2-5-1, Kasama, Sakae-k, Yokohama-shi Kanagawa 60, 2478560, JP)
International Classes:
H01L21/66; G01B11/24; H01L21/66; G01B11/24
Attorney, Agent or Firm:
HIGUCHI, Masaki (003 Felice Yokohama Residence, 2-12-26 Kitasaiwai, Nishi-k, Yokohama-shi Kanagawa 04, 2200004, JP)
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