DISCHARGE-ASSISTED LASER BEAM DRILLING METHOD

WIPO Patent Application WO/2014/185206

A1

　A discharge-assisted laser beam drilling method characterized in that the distal end of a first electrode is distanced 0.1 mm or more from the surface of an insulating substrate and is disposed in a position displaced by 0.2 mm or more in a first direction from the center of a spot irradiated by laser light on the insulating substrate, the position at a distance of 0.5 mm or less from an existing through-hole along a second direction orthogonal to the first direction being set as the position where a through-hole is to be formed, and the distal end of the first electrode being a position nearer to the position where the through-hole is to be formed than the position of the existing through-hole when the position where the through-hole is to be formed is irradiated by laser light and an electrical discharge is then formed between electrodes, where a through-hole already formed in the insulating substrate is termed as the existing through-hole, the position where the existing through-hole is formed is termed as the position of the existing through-hole, and the position where a through-hole is subsequently formed on the insulating substrate is termed as the position where the through-hole is to be formed.

HORIUCHI KOHEI (JP)

PCT/JP2014/060746

November 20, 2014

April 15, 2014

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ASAHI GLASS CO LTD (JP)

B23K26/382; B23H7/38; B23H9/14

WO2013058169A1

2013-04-25

JP2004216385A	2004-08-05
JP2013086236A	2013-05-13
JPH05208323A	1993-08-20
JP2012519090A	2012-08-23

ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)

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