Title:
DISCHARGE AUXILIARY-TYPE LASER APERTURE MACHINING DEVICE AND DISCHARGE AUXILIARY-TYPE LASER APERTURE MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/199775
Kind Code:
A1
Abstract:
Provided is a discharge auxiliary-type laser aperture machining device by which through holes are formed in an insulation substrate by laser light emission, and the shape of the through holes is adjusted using the discharge phenomenon between a first and second electrode, wherein the discharge auxiliary-type laser aperture machining device comprises a laser light source for emitting laser light, a homogenizer for forming a flat-top beam from the laser light, and a reduced projection system, and the discharge auxiliary-type laser aperture machining device is characterized in that the reduced projection system has a transfer lens for transferring to the insulation substrate an image surface generating the flat-top laser beam which was formed by the homogenizer and an image generated on the image surface.
Inventors:
ONO MOTOSHI (JP)
Application Number:
PCT/JP2014/063180
Publication Date:
December 18, 2014
Filing Date:
May 19, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B23K26/382; B23H7/38; B23K26/04; B23K26/064; B23K26/066; B23K26/60; B26F3/00
Domestic Patent References:
| WO2011038788A1 | 2011-04-07 | |||
| WO2006129369A1 | 2006-12-07 | |||
| WO2013058169A1 | 2013-04-25 |
Foreign References:
| JP2007021690A | 2007-02-01 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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