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Title:
DISCOLORATION-RESISTANT COPPER ALLOY AND COPPER ALLOY MEMBER
Document Type and Number:
WIPO Patent Application WO/2015/046421
Kind Code:
A1
Abstract:
 Provided is a metal structure containing 17-34 mass% Zn, 0.01-2.5 mass% Sn, 0.005-1.8 mass% Al, and 0.0005-0.030 mass% Pb, the balance being Cu and unavoidable impurities, the above elements being contained in amounts such that the relationships 24 ≤ [Zn] + 5 × [Sn] + 3 × [Al] ≤ 40 and 1.2 ≤ [Sn] + 2 × [Al] ≤ 4.0 are satisfied, the area ratio (γ)% of the γ phase and the area ratio (β)% of the β phase in the α-phase matrix having the relationship 0 ≤ 2 × (γ) + (β) ≤ 1.5, and 0-0.7% of the γ phase and 0-0.9% of the β phase, in terms of area ratio, being dispersed in the α-phase matrix.

Inventors:
TANAKA SHINJI (JP)
OISHI KEIICHIRO (JP)
HATA KATSUHIKO (JP)
Application Number:
PCT/JP2014/075612
Publication Date:
April 02, 2015
Filing Date:
September 26, 2014
Export Citation:
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Assignee:
MITSUBISHI SHINDO KK (JP)
International Classes:
C22C9/04
Domestic Patent References:
WO2013115363A12013-08-08
Foreign References:
JP2007211317A2007-08-23
JPS6086231A1985-05-15
JPS6086233A1985-05-15
US20110142715A12011-06-16
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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