Title:
DISK-SHAPED COIL AND METHOD FOR MANUFACTURING DISK-SHAPED COIL
Document Type and Number:
WIPO Patent Application WO/2023/199887
Kind Code:
A1
Abstract:
Provided is a disk-shaped coil that can increase connection reliability and make an insulating layer less prone to collapse in the manufacturing process. This disk-shaped coil comprises at least one disk-shaped coil part having insulating layers disposed spaced apart, and conductive layers disposed in the gaps between the insulating layers, wherein the thickness of the insulating layer is at least 50 μm, the ratio of the width A1 of the insulating layer or the width A2 of the insulating layer to the width B of the insulating layer is at least 0.5 but less than 1.0, and the ratio of the width B of the insulating layer to the width C of the insulating layer is less than 1.0.
Inventors:
UEDA MICHIHISA (JP)
WATANABE TAKASHI (JP)
INOUE TAKANORI (JP)
FUJITA YOSHITO (JP)
HAMADA TAICHI (JP)
KUROSU MITSUHO (JP)
TANAKA TOMOYA (JP)
WATANABE TAKASHI (JP)
INOUE TAKANORI (JP)
FUJITA YOSHITO (JP)
HAMADA TAICHI (JP)
KUROSU MITSUHO (JP)
TANAKA TOMOYA (JP)
Application Number:
PCT/JP2023/014536
Publication Date:
October 19, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01F5/00; H01F41/04; H05K1/16
Domestic Patent References:
| WO2013171847A1 | 2013-11-21 |
Foreign References:
| JP2017017139A | 2017-01-19 | |||
| JP2014055288A | 2014-03-27 | |||
| JPS62123935A | 1987-06-05 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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