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Title:
DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/169012
Kind Code:
A1
Abstract:
The present invention forms a conductive pattern which exhibits low resistance on a substrate, and also exhibits high dispersion stability. A dispersion (1) including a copper oxide (2), a dispersion agent (3), and a reducing agent, wherein the reducing agent content falls within the range specified by formula (1), and the dispersion agent content falls within the range specified by formula (2). (1): 0.0001≤(reducing agent mass/copper oxide mass)≤0.10. (2): 0.0050≤(dispersion agent mass/copper oxide mass)≤0.30. Copper sintering is accelerated by promoting the reduction of copper oxide to copper during firing by inclusion of the reducing agent.

Inventors:
OHNO EIICHI (JP)
YUMOTO TORU (JP)
TSURUTA MASANORI (JP)
Application Number:
PCT/JP2018/010287
Publication Date:
September 20, 2018
Filing Date:
March 15, 2018
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
H01B1/22; H01B1/00; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
WO2014119498A12014-08-07
WO2003051562A12003-06-26
Foreign References:
EP3127969A12017-02-08
JP2004253794A2004-09-09
JP2007080720A2007-03-29
JP2015018675A2015-01-29
JP2013115004A2013-06-10
JP2004119686A2004-04-15
JP2009283547A2009-12-03
JPH0714427A1995-01-17
JPH01220303A1989-09-04
JP2016527665A2016-09-08
JP2017051568A2017-03-16
JP2017051569A2017-03-16
JP2017051570A2017-03-16
JP2017051571A2017-03-16
JP2017051572A2017-03-16
JP2017145188A2017-08-24
JP2018023239A2018-02-08
JP2018023242A2018-02-08
Other References:
See also references of EP 3598461A4
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (JP)
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