DISPERSION RESIN, METHOD FOR PREPARING SAME, AND PHOTORESIST COMPOSITION

WIPO Patent Application WO/2023/245625

A1

The present invention provides a dispersion resin, a method for preparing same, and a low-temperature-cured photoresist composition. The dispersion resin is represented by formula (2): (Z-A)n-Rm(2), n = 1-5, m = 1-5, and n + m ≤ 6; Z represents H, or an acrylic copolymer substituted with an amino, an epoxy group, an alkyl having 1 to 14 carbon atoms, a cycloalkyl having 3 to 14 carbon atoms, or an aryl; R represents at least one of C, N, a CH group, (I), or a linear alkyl having 6 to 14 carbon atoms, an aliphatic cycloalkyl, an aryl, and a heteroaryl; A is represented by formula (3): in formula (3), W is connected to Z, a carboxyl is connected to R, and W represents at least one of an H atom, a substituted or unsubstituted alkyl having 1 to 14 carbon atoms, an epoxyalkyl having 2 to 6 carbon atoms, a substituted or unsubstituted aryl having 3 to 14 carbon atoms, and a substituted or unsubstituted heteroaryl.

ZHONG MEIDI (CN)
CHEN YULONG (CN)
YUN XIANGJUN (CN)
LI WEI (CN)
REN GUANGFU (CN)
YANG XIA (CN)

PCT/CN2022/101147

December 28, 2023

June 24, 2022

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SHENZHEN BRTHRBORDER SEMICONDUCTOR MAT CO LTD (CN)

C08F2/38; C08F220/30; C08F8/34; C08F212/08; C08F220/06; C08F220/14; C08F220/18; C09D17/00; G02B5/20; G03F7/004

CN101134800A	2008-03-05
CN105037627A	2015-11-11
CN104007612A	2014-08-27
JP2014005466A	2014-01-16
JP2021038289A	2021-03-11

SUZHOU LINGSEM INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)

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