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Title:
DISPLAY DEVICE FABRICATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/162496
Kind Code:
A1
Abstract:
Provided is a high-definition or a high-resolution display device. This display device is fabricated by: forming a conductive film, a first layer, and a first sacrificial layer; processing the first layer and the first sacrificial layer to cause a portion of the conductive film to be exposed, and forming a second layer and a second sacrificial layer on top of the first sacrificial layer and the conductive film; processing the second layer and the second sacrificial layer to cause a portion of the conductive film to be exposed and processing the conductive film so as to form a first pixel electrode that overlaps the first sacrificial layer and a second electrode that overlaps the second sacrificial layer; forming an insulating film that at least covers the side surfaces of each of the first pixel electrode, second pixel electrode, first layer, and second layer, the side and top surfaces of the first sacrifice layer, and the side and top surfaces of the second sacrifice layer; processing the insulating film so as to form a side wall that at least covers the side surfaces of each of the first pixel electrode, second pixel electrode, first layer, and second layer; and removing the first and second sacrifice layers and forming a common electrode on top of the first and second layers.

Inventors:
HODO RYOTA (JP)
SASAGAWA SHINYA (JP)
HIURA YOSHIKAZU (JP)
FUJIE TAKAHIRO (JP)
YAMAZAKI SHUNPEI (JP)
Application Number:
PCT/IB2022/050367
Publication Date:
August 04, 2022
Filing Date:
January 18, 2022
Export Citation:
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Assignee:
SEMICONDUCTOR ENERGY LAB (JP)
International Classes:
G09F9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/04; H05B33/06; H05B33/10; H05B33/12; H05B33/22
Domestic Patent References:
WO2011064914A12011-06-03
Foreign References:
US20180123081A12018-05-03
JP2004145011A2004-05-20
US20180190941A12018-07-05
US20160118451A12016-04-28
JP2020035713A2020-03-05
US20180151819A12018-05-31
US20160372695A12016-12-22
JP2010212251A2010-09-24
US20190058022A12019-02-21
JP2002107762A2002-04-10
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