[Related Applications]

[0001 ]

The present Application for Patent claims priority to Japanese Patent Application No. 2012-244525, entitled "Display Device and Manufacturing Method of Same," filed November 6, 2012, assigned to the assignee hereof and hereby expressly incorporated by reference herein.

[Technical Field]

[0002]

The present invention relates to display devices and manufacturing methods of the same.

[Background Art]

[0003]

A MEMS display (micro-electro-mechanical system display) is a display that is expected to replace liquid-crystal displays. (See patent document 1 .) This display displays images by opening and closing a light-transmissive window using a mechanical shutter method, which differs from the liquid-crystal shutter method that uses polarized light. The shutter is composed of a thin film. The length and the width of a shutter that composes one pixel are of the order of 100 pm. The shutter thickness is of the order of several pm. The On/off behavior of one pixel is made possible by the opening and closing of one shutter. The shutter is operated by electrostatic attraction.

[Prior Art Documents]

[Patent Documents] [0004]

[Patent Document 1 ] Japanese unexamined patent application publication 2008- 197668

[Summary of the Invention]

[Problem to be Solved by the Invention]

[0005]

The shutter is disposed in a space enclosed by a seal between a pair of glass substrates. The space is filled with a liquid (oil). Oil prevents sticking of a spring that is used for driving the shutter, and reduces a difference in optical refractive indices with the light-transmissive substrates. Furthermore, a voltage required to drive the shutter is reduced due to the oil's higher permittivity.

[0006] In this structure, when the ambient temperature is below freezing, the oil contracts thereby causing the glass substrates to bend inwardly and touch the internal structures. Conversely, it is possible to prevent the bending of the glass substrates if a distance between the pair of glass substrates is controlled by disposing a spacer inside. However, in such a case, there is a problem that a bubble can develop in the oil.

[0007]

Objects of the present invention are to prevent the substrates from touching an internal structure, and to prevent a bubble from developing in a liquid filled inside. [Means for Solving the Problem]

[0008]

(1 ) The display device pursuant to the present invention is characterized in that it includes a first substrate; a shutter formed on the first substrate and a drive unit connected to the shutter; a second substrate arranged opposite to the first substrate at a distance; sealing material that seals a space maintaining the distance between the first substrate and the second substrate; a liquid filling in the space; and a first spacer and a second spacer having different heights in the distance direction disposed between the first substrate and the second substrate. With the present invention, bending of the first substrate and the second substrate is controlled by the first spacer and the second spacer to prevent contact with the internal structure. Also, because the first spacer and the second spacer heights are different, a low spacer permits some degree of bending of the first substrate and a second substrate so this prevents bubbles from developing in the liquid.

[0009]

(2) In the display device disclosed in (1 ), the height of the first spacer is the same height as the height of the sealing material and may be characterized to be greater than the second spacer height.

[0010]

(3) In the display device disclosed in (1 ) or (2), at least one of the first spacer and the second spacer may be characterized by being composed of a pedestal and a column.

[001 1 ]

(4) In the display device disclosed in (1 ) or (2), the first spacer and the second spacer may be characterized by each being composed of a pedestal with a different height formed on the first substrate.

[0012]

(5) In the display device disclosed in (1 ) or (2), the first spacer and the second spacer may be characterized by each being composed of a column with a different height formed on the second substrate. [0013]

(6) In the display device disclosed in (1 ) or (2), the first spacer is composed of a first pedestal formed on the first substrate and a first column formed on the second substrate; the second spacer is composed of a second pedestal formed on the first substrate and a second column formed on the second substrate. It may be characterized that heights of the first pedestal and the second pedestal are different, and that heights of the first column and the second column are the same.

[0014]

(7) A manufacturing method of the display device pursuant to the present invention includes a process for preparing the first substrate; a process for preparing the second substrate; and a process for disposing the second substrate opposite to the first substrate at a distance, and sealing a liquid using a sealing material to maintain the distance between the first substrate and the second substrate. It may be characterized that the process for preparing the first substrate includes forming the shutter and drive unit connected to the shutter; at least one of the process for preparing the first substrate and the process for preparing the second substrate includes forming the first spacer and the second spacer having different heights; and includes the process for disposing the second substrate opposite to the first substrate, disposing the first spacer and the second spacer between the first substrate and the second substrate to have heights in the distance direction. With the present invention, bending of the first substrate and the second substrate is controlled by the first spacer and the second spacer so as to prevent contact with the internal structure. Also, because the first spacer and the second spacer heights are different, a low spacer permits some degree of bending of the first substrate and a second substrate to prevent bubbles from developing in the liquid. [0015]

(8) The manufacturing method of the display device disclosed in (7) may be characterized in that at least a portion of the first spacer and the second spacer is formed simultaneously with forming the shutter in the process for preparing the first substrate.

[Brief Description of the Drawings]

[0016]

Fig. 1 is a schematic section of a display device pursuant to an embodiment of the present invention;

Fig. 2 is a perspective view of a shutter and a drive unit therefor;

Fig. 3 is a view to explain a manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 4 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 5 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 6 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 7 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 8 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 9 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention; Fig. 10 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 1 1 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 12 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 13 is a view to explain the manufacturing method of the display device pursuant to the embodiment of the present invention;

Fig. 14 is a schematic section of the display device pursuant to alternative embodiment 1 of the embodiment of the present invention;

Fig. 15 is a schematic section of the display device pursuant to alternative embodiment 2 of the embodiment of the present invention; and

Fig. 16 is a schematic section of the display device pursuant to alternative embodiment 3 of the embodiment of the present invention.

[Mode for Carrying Out the Invention]

[0017]

Embodiments of the present invention will now be described below with reference to the drawings.

[0018]

Fig. 1 is a schematic section of the display device pursuant to an embodiment of the present invention. The display device has a light-transmissive first substrate 10 (for example, a glass substrate), and a light-transmissive second substrate 12 (for example, a glass substrate). The first substrate 10 and the second substrate 12 are opposingly disposed at a distance. The first substrate 10 is a circuit board formed with a thin-film transistor or wiring and the like, not shown in the drawing, or a TFT (Thin Film Transistor) substrate. A plurality (numerous) of shutters 14 is disposed on the first substrate 10. The shutters 14 are coupled to the thin-film transistor or the wiring or the like, not shown in the drawings.

[0019]

Fig. 2 is a perspective view of the shutter and the drive unit therefor. The shutters 14 are composed of an inorganic material. The shutters 14 are plates that include an opening 16. Furthermore, a concave portion 18 that increases the shutter's strength is formed in the shutters 14, but the concave portion 18 does not penetrate through the shutter. Light passes through the opening 16; but portions other than the opening 16 block light. The opening 16 has a long-shape in one direction. Furthermore, light is supplied from a backlight 20 stacked on the second substrate 12.

[0020]

The shutters 14 are disposed to be suspended from the first substrate 10 by being supported by a first spring 22. The shutters 14 are supported by a plurality of (four in Fig. 2) the first spring 22. The first spring 22 is fastened to the first substrate 10 by a first anchor 24.

[0021 ]

The first spring 22 is composed of a material that elastically deforms. The first spring 22 has a thin, plate shape. A thickness direction is arranged in a lateral direction (a direction parallel to a plate face of the first substrate 10), and a width direction is arranged in the up and down directions (a direction perpendicular to the plate face of the first substrate 10). This makes it possible for the first spring 22 to deform in the lateral direction, which is the thickness direction. [0022]

The first spring 22 includes a first portion 26 that extends in a direction away (a direction that intersects (for example at a right angle) a length direction of the opening 16) from the shutters 14; a second portion 28 that extends toward an outside direction from a center of the length direction of the opening 16, that is a direction along the length direction of the opening 16; and a third portion 30 that extends in a direction further away (a direction that intersects (for example at a right angle) the length direction of the opening 16) from the shutters 14. Also, the shutters 14 are supported by the first spring 22 to be able to move in the direction that intersects the length direction of the opening 16 (for example at a right angle), as indicated by arrows in Fig. 2.

[0023]

A second spring 34 is supported by a second anchor 32, which is disposed on the first substrate 10. The second spring 34 is also composed of a material that elastically deforms. The second spring 34 has a thin, plate shape. Its thickness direction is arranged in a lateral direction (a direction parallel to the plate face of the first substrate 10), and its width direction is arranged in the up and down directions (a direction perpendicular to the plate face of the first substrate 10). This makes it possible for the second spring 34 to deform in the lateral direction, which is the thickness direction. Furthermore, the second spring 34 has a looped shape. A band that extends from the second anchor 32 is bent to turn back and return to the same second anchor 32.

[0024]

The second spring 34 opposes a second portion 28 along a side further away from the shutters 14 than the second portion 28 on a first spring 22. The second portion 28 is pulled to the second spring 34 by electrostatic attraction generated by a potential difference with respect to the second portion 28 on the first spring 22, the potential difference being created by charging a voltage to the second anchor 32. When the second portion 28 is pulled, the shutters 14 are also pulled via the first portion 26 that is integrated to the second portion 28. In other words, the first spring 22 and the second spring 34 constitute a drive unit 36 for mechanically driving the shutters 14. This drive unit 36 is formed of a material that is the same as at least a portion of the shutters 14.

[0025]

As shown in Fig. 1 , a light-blocking film 38 is formed on the second substrate 12. A fixed opening 40 is formed in the light-blocking film 38. The aforementioned opening 16 in the shutter 14 and the fixed opening 40 of the light-blocking film 38 are arranged at opposing positions. Light passes through if both communicate. Light is blocked when the fixed opening 40 in the light-blocking film 38 is shielded by the movement of the shutter 14. Said another way, the shutters 14 are mechanically driven to control the transmission and blocking of light to the fixed opening 40 in the light-blocking film 38. One shutter 14 corresponds to one pixel; images are displayed by a plurality of pixels. For that reason, a plurality (numerous) of shutters 14 are disposed. The shutters 14 and drive unit 36 are arranged in a display region that displays images by a presence and a strength of light that passes through the opening 16 and the fixed opening 40.

[0026]

The first substrate 10 and the second substrate 12 are fastened at a distance by a sealing material 42, shown in Fig. 1 . The sealing material 42 bonds together opposing faces of the first substrate 10 and the second substrate 12. The sealing material 42 is formed using a comparatively hard plastic or a similar material, and does not easily deform, so that the height of the sealing material 42 does not easily fluctuate. A space between the first substrate 10 and the second substrate 12 is sealed by the sealing material 42. That space is filled with liquid 44 (for example, an oil like silicone oil or others). The shutters 14 and drive unit 36 are disposed in the liquid 44. The liquid 44 suppresses vibrations caused by movement of the shutters 14 and drive unit 36, and prevents seizing of the first spring 22 and the second spring 34. In a case where the first substrate 10 and the second substrate 12 are composed of glass, if liquid 44 is used that has a refractive index that is close to that of glass, by filling with the liquid 44, light reflection is reduced at the boundary faces of the first substrate 10 and the second substrate 12.

[0027]

A plurality of a first spacer 46 and a plurality of a second spacer 48 are disposed between the first substrate 10 and the second substrate 12. The first spacer 46 and the second spacer 48 have heights in the direction of the distance between the first substrate 10 and the second substrate 12. The heights of the first spacer 46 and the second spacer 48 are different.

[0028]

The height of the first spacer 46 is the same as the height of the sealing material 42. The height of the first spacer 46 is greater than the height of the second spacer 48. The first spacer 46 is composed of a pedestal 50 disposed on the first substrate 10 and a column 52 disposed on the second substrate 12. Conversely, the second spacer 48 is composed of only the column 52 disposed on the second substrate 12, forming a gap with respect to the first substrate 10. [0029]

According to this embodiment, as the ambient temperature drops (for example, below freezing), the liquid 44 contracts. However, because the sealing material 42 does not contract easily, at least one of the first substrate 10 and the second substrate 12 bends toward the inside. This results in the gap between the first substrate 10 and the second substrate 12 becoming narrower. However, bending of the first substrate 10 and the second substrate 12 is controlled by the first spacer 46 and the second spacer 48, preventing contact with the inner structure. Also, because heights of the first spacer 46 and the second spacer 48 are different, the smaller second spacer 48 permits a certain degree of bending of the first substrate 10 and the second substrate 12. Thus, it is possible to prevent bubbles from developing in the liquid 44.

[0030]

A manufacturing method for the display device pursuant to this embodiment of the present invention will now be described.

[0031 ]

As shown in Fig. 3, the first substrate 10 is prepared. A first photoresist layer 54 is formed on the first substrate 10. The first photoresist layer 54 is a plastic having photosensitivity. The first photoresist layer 54 has at least a thickness that corresponds to a suspended height of the shutters 14. In other words, the thickness of the first photoresist layer 54 is the same as or greater than the shutter's 14 suspended height. Also, the first photoresist layer 54 has at least a thickness that corresponds to a suspended height of a portion of the drive unit 36 suspended from the first substrate 10 (for example, the first spring 22 and the second spring 34). In other words, the thickness of the first photoresist layer 54 is the same or greater than the suspended heights of the first spring 22 and the second spring 34.

[0032]

As shown in Fig. 4, photolithography is used to pattern the first photoresist layer 54. Photolithography includes lithographic exposure and developing. With lithographic exposure, the first photoresist layer 54 is partially irradiated through a mask, not shown in the drawing. This will yield a portion of the first photoresist layer 54 that dissolves in a developing solution, and a portion that does not easily dissolve in the developing solution. The first photoresist layer 54 is then patterned by developing. The patterned first photoresist layer 54 has a first top face 56. The first top face 56 is a face for forming a member (for example, the shutters 14, and the first spring 22 and the second spring 34) that is arranged to be suspended over the first substrate 10. Therefore, the height of the first top face 56 (a height from the top face of the first substrate 10; the same applies below) is the height of a bottom edge (the lowest face) of the shutters 14, and the bottom edges of the first spring 22 and the second spring 34. Also, the first photoresist layer 54 contracts by undergoing a curing process so that the height of the first top face 56 becomes slightly lower than its height before undergoing the curing process.

[0033]

As shown in Fig. 5, form a second photoresist layer 58 onto the patterned first photoresist layer 54. The second photoresist layer 58 is a plastic precursor having photosensitivity. The second photoresist layer 58 has at least a thickness that corresponds to a width in the height direction of the first spring 22 and the second spring 34. In other words, the thickness of the second photoresist layer 58 is the same as or greater than the width, in the height direction, of the first spring 22 and the second spring 34. Also, when forming the concave portions 18 in the shutters 14, the second photoresist layer 58 has at least a thickness that corresponds to a depth of the concave portion 18 (more precisely, a difference in height from a projected bottom face of the concave portion 18 that projects downward to the bottom face of a portion surrounding the concave portion 18). In other words, the thickness of the second photoresist layer 58 is the same or greater than the depth of the concave portion 18.

[0034]

As shown in Fig. 6, use photolithography to pattern the second photoresist layer 58. Details of photolithography are the same as those described above. The patterned second photoresist layer 58 has a second top face 60. The second photoresist layer 58 contracts by undergoing a curing process, such that the height of the second top face 60 becomes slightly lower than its height before undergoing the curing process. The height from the first top face 56 to the second top face 60 is equivalent to the width, in the height direction, of the first spring 22 and the second spring 34. Also, the height from the first top face 56 to the second top face 60 is equivalent to the depths of the concave portions 18 in the shutters 14.

[0035]

In this way, form a plastic layer 62 from the first photoresist layer 54 and the second photoresist layer 58. In other words, form the patterned plastic layer 62 on the first substrate 10. Form the plastic layer 62 in a forming area of the shutters 14 and the drive unit 36. The plastic layer 62 includes the lowest first top face 56. The plastic layer 62 includes the (highest) second top face 60 that is higher than the first top face 56. The plastic layer 62 has a first side face 64 that extends towards the bottom face from the first top face 56. The plastic layer 62 has a second side face 66 that rises from the first top face 56 towards a second top face 60.

[0036]

As shown in Fig. 7, form a film 68 on the plastic layer 62 and the first substrate 10. Form the film 68 with material that forms the shutters 14 and the drive unit 36. Also form the pedestal 50 on the first spacer 46 from the film 68. It is acceptable to form a plurality of layers of the film 68. For example, form a first film 70 composed of a semiconductor, such as amorphous silicon, and thereover form a second film 72 composed of metal such aluminum or the like.

[0037]

As shown in Fig. 8, form etching resist 74 on the film 68.

[0038]

As shown in Fig. 9, pattern the etching resist 74. It is possible to adopt lithography for this patterning as well. The patterned etching resist 74 covers an area to form the pedestal 50 that is one portion of the shutters 14, drive unit 36 and the first spacer 46.

[0039]

As shown in Fig. 10, apply wet etching to etch the second film 72 composed of a metal. The second film 72, which is exposed through the etching resist 74, is removed by exposure in the lateral direction, because of the isotropic nature of wet etching.

[0040]

As shown in Fig. 1 1 , apply dry etching to etch the first film 70 composed of the semiconductor. The first film 70 on the top face (first top face 56 and second top face 60) of the plastic layer 62 is removed, but the first film 70 of the side face (the second side face 66) of the plastic layer 62 is not removed, and remains, because of the anisotropic nature of dry etching.

[0041 ]

As shown in Fig. 12, remove the etching resist 74. Also, remove the plastic layer 62 exposed from the film 68. To remove these, for example, it is acceptable to apply ashing. It is acceptable to remove the plastic layer 62 and the etching resist 74 at the same time.

[0042]

The pedestal 50 of the first spacer 46, the shutters 14, and the drive unit 36 for mechanically driving the shutters 14 are formed on the first substrate 10. Pursuant to this embodiment, at the same time as forming the shutters 14, form at least a portion (for example, the pedestal 50 of the first spacer 46) of the first spacer 46 and the second spacer 48.

[0043]

Next, as shown in Fig. 13, prepare the second substrate 12. Form a portion (the column 52) of the first spacer 46 on the second substrate 12. Form the second spacer 48 (the column 52) on the second substrate 12.

[0044]

Arrange the first substrate 10 and the second substrate 12 to be opposed to each other, at a distance from each other. As shown in Fig. 1 , partition a space by maintaining a gap between the first substrate 10 and the second substrate 12 using the sealing material 42. Then, fill the space with the liquid 44. Arrange the first spacer 46 and the second spacer 48 to include heights, in the distance direction, between the first substrate 10 and the second substrate 12. [0045]

Pursuant to the embodiment, bending of the first substrate 10 and the second substrate 12 is controlled by the first spacer 46 and the second spacer 48 so these prevent contact with the inner structure. Also, because heights of the first spacer 46 and the second spacer 48 are different, the lower second spacer 48 permits a certain degree of bending of the first substrate 10 and the second substrate 12, to prevent bubbles from developing in the liquid 44.

[0046]

[Alternative Embodiment 1 ]

Fig. 14 is a schematic section of the display device pursuant to a first alternative embodiment 1 of the embodiment of the present invention. In this example, the first spacer 146 and the second spacer 148 are composed of columns of different heights formed on the second substrate 12. The second spacer 148 is formed lower than the first spacer 146, forming a gap with respect to the first substrate 10. The first spacer 146 and the second spacer 148 are composed of plastic. It is acceptable to apply the photolithographic process for the photoresist used in this manufacturing process. In such a case, it is acceptable to apply halftone exposure to form the first spacer 146 and the second spacer 148 at the same time to have different heights. The second spacer 148 shown in Fig. 14 is an example of a chevron-shaped spacer attained through the halftone exposure. The content described for the embodiment above applies to other details.

[0047]

[Alternative Embodiment 2]

Fig. 15 is a schematic section of the display device pursuant to a second alternative embodiment of the embodiment of the present invention. In this example, a first spacer 246 is composed of a first pedestal 276 formed on a first substrate 210 and a first column 278 formed on a second substrate 212. The first column 278 is formed from plastic such as resist or a similar material. The first pedestal 276 and the first column 278 are opposingly arranged; the total height of both is a height of the first spacer 246. The second spacer 248 is composed of a second pedestal 280 formed on a first substrate 210 and a second column 282 formed on a second substrate 212. The second column 282 is formed from plastic such as resist or a similar material. The second pedestal 280 and the second column 282 are opposingly arranged; the total height of both is a height of the second spacer 248.

[0048]

The first column 278 and the second column 282 are the same height, but the heights of the first pedestal 276 and the second pedestal 280 are different. More specifically, the first pedestal 276 is lower than the second pedestal 280. For that reason, a gap is formed between the first pedestal 276 and the first column 278. Also, heights of the first spacer 246 and the second spacer 248 are different.

[0049]

Each of the first pedestal 276 and the second pedestal 280 has a laminated structure of a semiconductor film 284 composed of a-Si and the like to form a semiconductor layer for a thin-film transistor; a first insulating film 286 composed of inorganic material (Si0 ₂ , SiN and the like) and the like for forming a gate insulating film; a first conducting film 288 composed of metal such as Al and the like for forming a gate electrode; a second insulating film 290 composed of inorganic material (Si0 ₂ , SiN and the like) and the like; a second conducting film 292 for forming a drain electrode and source electrode; and a third insulating film 296 composed of inorganic material (Si0 ₂ , SiN and the like) and the like. [0050]

Furthermore, the second pedestal 280 has a laminated structure of a third conducting film 294 for forming wiring composed of ITO (Indium Tin Oxide) and the like, and a film 268 (a first film 270 composed of a semiconductor such as a-Si and the like, and a second film 272 composed of metal such as Al or the like) for forming a shutter 214. The first pedestal 276 is lower than the second pedestal 280 because it does not have the laminated structure. Also, it is possible to design heights for each of the first pedestal 276 and the second pedestal 280 by selecting the film to laminate and the film not to laminate.

[0051 ]

With the manufacturing method of the display device pursuant to this alternative embodiment, at the same time as forming the shutters 214, form at least a portion (for example, the film 268 that is a portion of the second pedestal 280) of the first spacer 246 and the second spacer 248. Also, form a portion of the first spacer 246 and second spacer 248 (for example a portion of the first pedestal 276 and the second pedestal 280) at the same time as forming a circuit layer (for example, the thin-film transistor) on the first substrate 210. The content described for the embodiment above applies to other details.

[0052]

[Alternative Embodiment 3] Fig. 16 is a schematic section of the display device pursuant to alternative embodiment 3 of the embodiment of the present invention. In this example, a first spacer 346 and a second spacer 348 are each composed of only a first pedestal 376 and a second pedestal 380 having different heights formed on a first substrate 310. [0053]

A lower layer 376L on the first pedestal 376 and a lower layer 380L on the second pedestal 380 have a laminated structure that is the same as the first pedestal 276 shown in Fig. 15. A conducting film 394 for forming wiring composed of ITO (Indium Tin Oxide) and the like is disposed on the lower layer 380L of the second pedestal 380. Because the first pedestal 376 does not include this conducting film, it is lower than the second pedestal 380.

[0054]

An upper layer 376U on the first pedestal 376 and an upper layer 380U on the second pedestal 380 have laminated structures that include a plastic layer 362 (lower layer 362L and upper layer 36U) and a film 368 (a first film 370 and a second film 372) that covers the plastic layer 362. The first film 370 is composed of a semiconductor such as a-Si or the like which is a material that the shutters 314 are composed of. The second film 372 is metal, such as Al. The plastic layer 362 is a foundation layer for the film 368 (the first film 370 and the second film 372). It is removed from thereunder when forming the shutters 314 and the drive unit 336, but a portion of the plastic layer 362 within the first spacer 346 and the second spacer 348 remains as a structure.

[0055]

In the manufacturing method of the display device pursuant to this alternative embodiment, at the same time as forming the shutters 314, form at least a portion of the first spacer 346 and the second spacer 348 (for example, the upper layer 376U on the first pedestal 376 and the upper layer 380U of the second pedestal 380). Also, form a portion of the first spacer 346 and the second spacer 348 (for example, the lower layer 376L of the first pedestal 376, the lower layer 380L of the second pedestal 380, and the conducting film 394) at the same time as forming a circuit layer (for example, the thin-film transistor) on the first substrate 310. The content described for the embodiment above applies to other details of this implementation. [0056]

The present invention is not limited to the embodiment described above, and various modifications are possible. Furthermore, it is possible to switch the constitution described in the embodiments above with a constitution that is substantially the same constitution that attains the same functional effects, or achieves the same objective.

[Explanation of Letters or Numerals]

[0057]

10 First substrate 50 Pedestal

12 Second substrate 52 Column

14 Shutter 54 First photoresist layer

16 Opening 56 First top face

18 Concave portion 58 Second photoresist layer

20 Backlight 60 Second top face

22 First spring 62 Plastic layer

24 First anchor 64 First side face

26 First portion 66 Second side face

28 Second portion 68 Film

30 Third portion 70 First film

32 Second anchor 72 Second film

34 Second spring 74 Etching resist

36 Drive unit 146 First spacer

38 Light-blocking film 148 Second spacer

40 Fixed opening 210 First substrate

42 Sealing material 212 Second substrate

44 Liquid 214 Shutter

46 First spacer 246 First spacer

48 Second spacer 248 Second spacer 268 Film 296 Third insulating film

270 First film 310 First substrate

272 Second film 314 Shutter

276 First pedestal 336 Drive unit

278 First column 346 First spacer

280 Second pedestal 348 Second spacer

282 Second column 362 Plastic layer

284 Semiconductor film 368 Film

286 First insulating film 370 First film

288 First conducting film 372 Second film

290 Second insulating film 376 First pedestal

292 Second conducting film 380 Second pedestal

294 Third conducting film 394 Conducting film