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Patent Searching and Data


Title:
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/186882
Kind Code:
A1
Abstract:
This display device is provided with: display wiring (15) that is provided on a resin substrate layer (7); a flattened film (16) that covers the display wiring; and an organic EL element (9) that is provided on the flattened film. The display wiring has first to third conductive layers (47, 48, 49) which are laminated in order from the resin substrate layer side. The display wiring is formed such that: the second conductive layer is formed narrower in width than the first and third conductive layers; a part of the peripheral end surface that corresponds to the second conductive layer has a recess (50); the display wiring including the peripheral end surface is exposed from the flattened film; and a resin cover (51) is provided to the recess (50) in the part of the display wiring that is exposed from the flattened film, so as to cover the peripheral end surface of the second conductive layer.

Inventors:
SENOO Tohru
HIRASE Takeshi
OCHI Hisao
OCHI Takashi
SONODA Tohru
MATSUI Akihiro
TAKAHASHI Jumpei
MIYAMOTO Yoshinobu
YANEDA Takeshi
Application Number:
JP2018/013205
Publication Date:
October 03, 2019
Filing Date:
March 29, 2018
Export Citation:
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Assignee:
SHARP KABUSHIKI KAISHA (1 Takumi-cho, Sakai-ku Sakai Cit, Osaka 22, 〒5908522, JP)
International Classes:
H05B33/02; G09F9/30; H01L27/32; H01L51/50; H05B33/06
Domestic Patent References:
WO2014199673A12014-12-18
Foreign References:
JP2010522411A2010-07-01
JP2016224297A2016-12-28
JP2012119330A2012-06-21
JP2004158826A2004-06-03
JP2018025671A2018-02-15
JP2007164183A2007-06-28
JP2004077856A2004-03-11
Attorney, Agent or Firm:
MAEDA & PARTNERS (Shin-Daibiru Bldg. 23F, 2-1 Dojimahama 1-chome, Kita-ku, Osaka-sh, Osaka 04, 〒5300004, JP)
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