Title:
DISPLAY PANEL AND CUTTING METHOD THEREFOR, DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/096006
Kind Code:
A1
Abstract:
A display panel and a cutting method therefor, and a display device. The cutting method comprises: using a first laser to cut a mother board (01) to be cut into multiple independent display panels (101), wherein the display panels (101) comprise multiple leads (20); and using a second laser to at least cut off a short circuited lead (20) at a cutting location, close to the first laser, on the display panels (101), wherein a cutting direction of the second laser is perpendicular to an extension direction of the lead (20). Also provided are a display panel, and a display device comprising the display panel. By means of the cutting method, the short circuit problem of an edge lead caused on a display panel by high-temperature hot melting by a laser after mother board cutting can be improved, and the product yield after cutting is improved. By means of the display panel and the display device, detection of electrical performance can be facilitated, improving the efficiency of lead connection.
Inventors:
WU XIAOPING (CN)
PARK JEONGHUN (CN)
WANG BO (CN)
PARK JEONGHUN (CN)
WANG BO (CN)
Application Number:
PCT/CN2018/112999
Publication Date:
May 23, 2019
Filing Date:
October 31, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
B23K26/38
Foreign References:
| CN107855665A | 2018-03-30 | |||
| CN106914707A | 2017-07-04 | |||
| CN101435923A | 2009-05-20 | |||
| CN107331294A | 2017-11-07 | |||
| CN102789072A | 2012-11-21 | |||
| CN101093333A | 2007-12-26 | |||
| JPH02232991A | 1990-09-14 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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