Title:
DISTRIBUTION MEASURING SENSOR, DISTRIBUTION MEASURING SENSOR SYSTEM, DISTRIBUTION MEASURING PROGRAM, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2018/084284
Kind Code:
A1
Abstract:
Provided are a distribution measuring sensor system and the like having a high spatial resolution, with which a routing wiring region can be markedly reduced even if multiple sensor devices are integrated in order to measure a contact pressure and a shear stress acting at an interface between a living body and an object.
A distribution measuring sensor 10 has a construction in which sensor units Uij which measure a shear stress in a planar direction and a contact pressure in a direction perpendicular to the plane are disposed at each element of a matrix M. The sensor units Uij comprise an upper electrode UijH common to measurement of the shear stress and the contact pressure, and a lower electrode UijL disposed below the upper electrode UijH with a pressure sensitive material 20 or the like interposed therebetween. The upper electrodes UijH of each sensor unit Uij disposed in the same column j of the matrix M, in an x-axis direction, are connected in common, in the column j direction, by means of a connecting line Cj. The lower electrodes UijL of each sensor unit Uij disposed in the same row i of the matrix M, in a y-axis direction, are connected in common, in the row i direction, by means of a connecting line Ri.
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Inventors:
SASAGAWA KAZUHIKO (JP)
Application Number:
PCT/JP2017/039936
Publication Date:
May 11, 2018
Filing Date:
November 06, 2017
Export Citation:
Assignee:
UNIV HIROSAKI (JP)
International Classes:
G01L5/00; G01L1/20; G01L5/16
Domestic Patent References:
WO2015176032A1 | 2015-11-19 |
Foreign References:
JP3983638B2 | 2007-09-26 | |||
JP2012168064A | 2012-09-06 | |||
JP2015169532A | 2015-09-28 | |||
US5571973A | 1996-11-05 | |||
US7343813B1 | 2008-03-18 |
Attorney, Agent or Firm:
TANIDA Takuo (JP)
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