Field

The present invention relates to a domestic heating apparatus, in particular a domestic heating apparatus with integrated heat storage dynamically configured to improve the efficiency and utility of an air source heat pump. This apparatus may also utilise waste heat from a computing device which is stored for subsequent use for the provision of domestic heating.

Background

There is a recognised need to decarbonise domestic heating, and use of renewable energy is increasing.

Heat exchangers are ubiquitous devices used to transfer heat from one medium to another. Often they are used to dump heat into the environment as an unwanted by product of a process (for example, the radiator of a car’s combustion engine) or collect heat from the environment for its later use (for example air/ground/water sourced heat pumps). When two processes have different thermal needs they may be matched using heat exchangers.

Air source heat pumps (ASHPs) are a form of heat engine that extracts energy from ambient air by passing it over expanded cold gases. These gases are later compressed to liquid form resulting in the controlled release of heat for the users benefit. ASHPs are being increasingly used in the home environment due to their efficiency when supplying domestic hot water and central heating (and underfloor heating).

Summary

In a first aspect, there is provided a heating unit comprising a heat exchanger device, a heat storage device configured to store heat output by the heat exchanger device for future use, a configurable manifold configured to operate in at least two operating modes, and a controller configured to control the configurable manifold. The heating unit may comprise a domestic heating unit. The heat exchanger device may comprise an air source heat pump (ASHP). The heat storage device may be a domestic heat storage device configured to store heat output by the ASHP for future use. Each operating mode of the configurable manifold may comprise a different flow of heat through at least part of the configurable manifold. The controller may be configured to control the configurable manifold so as to switch between at least one of the operating modes and a further at least one of the operating modes, thereby providing different flows of heat between the heat exchanger device and/or domestic heat storage device and/or a domestic dwelling heated by the heating device.

A first one of the at least two operating modes may be configured to direct heat from the ASHP to the domestic dwelling. A second one of the at least two operating modes may be configured to direct heat from the domestic heat storage device to the domestic dwelling. A further one of the at least two operating modes may be configured to direct heat from the ASHP to the domestic heat storage device without directing heat to the domestic dwelling.

The unit may be configured to provide central heating for the domestic dwelling. The unit may be configured to provide underfloor heating for the domestic dwelling. The unit may be configured to provide hot water for the domestic dwelling.

The unit may further comprise computing equipment configured to provide a distributed computing resource, wherein, in operation, the computing equipment outputs heat. The unit may further comprise a computing equipment heat storage device configured to store heat that is output by the computing equipment, so as to provide asynchronous heat transfer between the computing equipment and the heat exchanger device.

The domestic heat storage device and heat exchanger device may be housed within a common enclosure. The computing equipment and computing equipment heat storage device may be housed within the common enclosure. The common enclosure may be configured to be mounted to the outside of a domestic dwelling.

The ASHP may be configured to convert heat from the computing equipment heat storage device into domestic heat by using the heat from the computing equipment heat storage device to pre-heat a refrigerant employed by the ASHP. The ASHP may be configured to convert heat from the computing equipment heat storage device into domestic heat by using the heat from the computing equipment heat storage device to pre-heat air input to the ASHP.

The heat exchanger device may comprise a high temperature ASHP.

The computing equipment heat storage device may be a single heat storage device that is common to a process of cooling the computing equipment and a process of providing the domestic heat.

The unit may further comprising a cold storage device. The computing equipment heat storage device may be configured to be used in a process of cooling the computing equipment. The cold storage device may be configured to be used in the process of providing domestic heat by pre-heating the refrigerant of the ASHP. The cold storage device may be configured to be used in the process of providing domestic heat by pre heating air input to the ASHP.

The cold storage device and computing equipment heat storage device may each comprise a respective phase change material. A freezing temperature of the phase change material of the computing equipment heat storage device may be higher than a freezing temperature of the phase change material of the cold storage device.

The computing equipment heat storage device and the cold storage device may be coupled by a control loop. The control loop may be used to exchange heat between the computing equipment heat storage device and the cold storage device in a controlled manner.

The domestic heat storage device may comprise a phase transition heat transfer device. The computing equipment heat storage device may comprise a phase transition heat transfer device. The cold storage device may comprise a phase transition heat transfer device.

The unit may further comprise a hot water outlet configured to supply hot water for domestic use. The heat exchanger device may be configured to heat water passing into the hot water outlet. The domestic heat storage device may be configured to heat water passing into the hot water outlet.

The unit may further comprise at least one ambient environment heat exchanger configured to exchange heat with the ambient environment. The unit may further comprise a switch for switching the ambient temperature heat exchanger in and out of operation. The controller may be configured to control operation of the switch. A further controller may be configured to control operation of the switch.

The controller may be configured to control operation of the unit in dependence on at least one of: cooling needs of computing equipment, domestic heating needs, sensor data, pre-defined coefficients. A further controller may be configured to control operation of the unit in dependence on at least one of: cooling needs of computing equipment, domestic heating needs, sensor data, pre-defined coefficients.

The controller may be further configured to control operation of the unit in dependence on at least one of: electricity grid supply, electricity grid demand, computing resource supply, computing resource demand. A further controller may be further configured to control operation of the unit in dependence on at least one of: electricity grid supply, electricity grid demand, computing resource supply, computing resource demand.

The computing equipment may comprise at least one of a GPU array, a CPU array.

The unit may be configured to be powered by a single domestic power supply.

The unit may further comprise an electrical storage device configured to store electrical energy for use in operation of the unit and/or for resale.

In a further aspect of the invention, there is provided a distributed network comprising a plurality of units as claimed or described herein. The distributed network may further comprise at least one central controller configured to control operation of the plurality of units. The at least one central controller may be configured to match computing loads to at least one of: energy grid supply, energy grid demand, computing resource supply, computing resource demand.

In a further aspect, there is provided a method of providing domestic heat, the method comprising: controlling by a controller a configurable manifold to operate in each of the at least two operating modes, thereby providing different flows of heat between a heat exchanger device and/or a domestic heat storage device and/or a domestic dwelling heated by the domestic heating device, wherein the heat exchanger device comprises an ASHP; the domestic heat storage device is configured to store heat output by the ASHP for future use; and the configurable manifold configured to operate in at least two operating modes, each operating mode comprising a different flow of heat through at least part of the configurable manifold.

In a further aspect of the invention, there is provided a heating unit comprising: computing equipment configured to provide a distributed computing resource, wherein, in operation, the computing equipment outputs heat; a heat storage device configured to store heat that is output by the computing equipment, so as to provide asynchronous heat transfer between the computing equipment and a heat exchanger device; and the heat exchanger device. The heating unit may comprise a domestic heating unit. The heat exchanger device may be configured to convert heat from the heat storage device into domestic heat.

In a further aspect of the invention, there is provided a method of providing domestic heat, the method comprising: providing, by computing equipment, a distributed computing resource; outputting, by the computing equipment, heat; storing, by a heat storage device, heat that is output by the computing equipment, so as to provide asynchronous heat transfer between the computing equipment and a heat exchanger device; and converting, by the heat exchanger device, heat from the heat storage device into domestic heat.

In a further aspect of the invention, there is provided a domestic heating unit comprising: a heat storage device; a microprocessor configured as a digital system controller; a heat exchanger device, wherein the heat exchanger device is configured to convert heat from the heat storage device into domestic heat, and a configurable manifold, controlled by the digital system controller, to affect the unit’s operating mode.

In a further aspect of the invention, there is provided a domestic heating unit comprising: a heat exchanger device comprising an air source heat pump (ASHP); a heat storage device configured to store heat output by the ASHP for subsequent use; a microprocessor configured as a digital system controller; and a configurable manifold, controlled by the digital system controller, to affect the unit’s operating mode.

Features in one aspect may be applied as features in any other aspect, in any appropriate combination. For example, apparatus features may be provided as method features or vice versa.

Brief description of the drawings

Various aspects of the invention will now be described by way of example only, and with reference to the accompanying drawings, of which:

Figure 1 is a schematic illustration of a domestic heating unit in accordance with an embodiment;

Figure 2 is a schematic illustration of a domestic heating unit in accordance with an embodiment;

Figure 3 is a flow chart illustrating in overview a method of an embodiment;

Figure 4 is a table illustrating schematically different configurations of a configurable manifold in accordance with an embodiment;

Figure 5 is a schematic illustration of a system for unsynchronised heat exchange through a single thermal storage battery;

Figure 6 is a schematic illustration of a system for unsynchronised heat exchange through multiple thermal storage batteries;

Figure 7 is a schematic illustration of a system for unsynchronised heat exchange with an ambient temperature buffer;

Figure 8 is a schematic illustration of a system for unsynchronised heat exchange with an ambient temperature buffer and switchable exchange loops; and

Figure 9 is a flow chart illustrating in overview a sample control method for heat exchange through thermal storage with ambient temperature buffer. Detailed description

Figure 1 is a schematic illustration of a domestic heating unit 2 in accordance with an embodiment. The domestic heating unit 2 is configured to provide heating to a house 50, which is occupied by a homeowner or other resident. In other embodiments, the domestic heating unit 2 may be configured to provide central heating, underfloor heating and/or hot water to the house 50. In some embodiments, the domestic heating unit 2 may be retrofitted to an existing central heating system, for example a gas- powered central heating system.

The domestic heating unit 2 comprises an air source heat pump (ASHP) 4 and a computing device 6. The domestic heating unit 2 further comprises a heat storage device 8 positioned between the ASHP 4 and the computing device 6. The heat storage device 8 may be referred to as a computing equipment heat storage device 8. The ASHP 4 comprises a plurality of components as described below. In other embodiments, any suitable heat exchanger device may be used instead of or in addition to the ASHP 4. In further embodiments the domestic heating unit 2 does not comprise a computing device 6 and computing equipment heat storage device 8.

The computing device 6 comprises an array of blades or Graphics Processing Units (GPUs). In the present embodiment, the computing device 6 is a Tesla or CUDA GPU array, which is a relatively small and inexpensive array of GPUs. In other embodiments, the computing device 6 may comprise any suitable computing equipment. The computing device 6 is configured to provide a distributed computing resource, for example a computing resource for cloud-based computing.

In the present embodiment, the computing equipment heat storage device 8 comprises a phase change material. In other embodiments, the computing equipment heat storage device 8 may comprise any suitable heat storage material. For example, the computing equipment heat storage device 8 may comprise a water tank or an oil tank. While conventional liquid tanks (for example, water or oil) may be used for thermal storage, phase change materials may typically be denser and more stable in their heat storage. The domestic heating unit 2 further comprises conduits 10 and 12 which are configured to circulate a fluid between the computing device 6 and computing equipment heat storage device 8 to transfer waste heat from the computing device 6 to the computing equipment heat storage device 8. Any suitable fluid may be circulated in conduits 10, 12. The domestic heating unit 2 further comprises conduits 14 and 16 which are configured to circulate a further fluid between the computing equipment heat storage device 8 and ASHP 4 to transfer heat from the computing equipment heat storage device 8 to the input of the ASHP 4. Any suitable fluid may be circulated in conduits 14, 16.

The ASHP 4 comprises an evaporator heat exchanger 20 and associated fan 22, condensing heat exchanger 24, compressor 26, heat exchanger 28 and associated fan 30, and expansion device 32. The ASHP 4 further comprises conduits 40, 42, 45, 46 which are configured to circulate a refrigerant around the ASHP 4. The refrigerant is configured to change from liquid to gas and gas to liquid as described below. Any suitable refrigerant may be used.

In the present embodiment, the ASHP 4 is a low temperature ASHP. The system shown in Figure 1 is a low temperature, single block system.. In the current embodiment the final stages of heat extraction are provided within a single enclosure (not shown) which is positioned outside the house 50 (rather than one block outside the house and one block inside the house).

In other embodiments, a high temperature system is used. Amplification of heat may be provided through a second stage heat pump (not shown) in addition to a first ASHP, which may be similar to that shown in Figure 1. The second stage heat pump has no external unit or fan, but obtains heat energy from the first ASHP output. The second stage heat pump slows refrigerant flow through the second stage to raise the temperature. In embodiments, the second stage may also be provided in the single enclosure rather than inside the house.

In the present embodiment, the computing device 6 and computing equipment heat storage device 8 are also included inside the same enclosure as the ASHP 4. The enclosure is fabricated to occupy a position attached to the outside of a single domestic property, for example being mounted to a wall of the house 50. The enclosure is powered by a single domestic power supply (single phase in the UK).

In further embodiments, no computing device 6 and computing equipment heat storage device 8 are included within the enclosure.

Situating the domestic heating unit 2 in an external enclosure may enable easy access to the domestic heating unit 2. For example, the domestic heating unit 2 may be owned, operated and/or maintained by a third party who is not the homeowner or resident. In some circumstances, the homeowner or resident may not have access to the enclosure that houses the domestic heating unit 2.

In other embodiments, the computing device 6 and/or most or all of the components of the domestic heating unit 2 may be positioned outside the house 50. In some embodiments, most or all of the components of the domestic heating unit 2 are housed in a single enclosure. In further embodiments, some or all of the components of the domestic heating unit 2 may be positioned inside the house 50.

In use, the computing device 6 may be used to provide a distributed computing resource, for example a cloud-based computing resource. The computing device 6 is controlled by a computing resource controller (not shown) which is remote from the house 50. The computing device 6 may be connected to the computing resource controller via broadband link, for example a domestic broadband cable or fibre optic connection. The computing resource controller may allocate processes to the computing device 6 in dependence on a requirement for computing resources. For example, the computing device 6 may be used to perform neural-based computing processes.

In the present embodiment, the computing resource provided by the computing device 6 is not directly available to the homeowner or resident of the house 50. In other embodiments, at least part of the computing resource provided by the computing device 6 may be made available to the homeowner or resident.

In operation, the computing device 6 produces heat, which may usually be considered to be waste heat. A liquid cooled heat-sink (not shown) of the computing device 6 moves heat away from heat-generating components (not shown) of the computing device 6 and allows heat to pass from the computing device 6 into conduits 10, 12 which form a circuit between the computing device 6 and the computing equipment heat storage device 8. In Figure 1 , conduit 10 is the part of the circuit which passes liquid heated by the computing device 6 to the computing equipment heat storage device 8. Conduit 12 is the part of the circuit which passes cooler liquid from the computing equipment heat storage device 8 to the computing device 6. The computing device 6 is cooled by passing heat into the cooler liquid and thereby into the computing equipment heat storage device 8. In other embodiments, any suitable fluid may be used to transfer heat between the computing device 6 and computing equipment heat storage device 8.

When required (for example, when a controller of the domestic heat device 2 is triggered by demand from the house 50), heat is passed from the computing equipment heat storage device 8 to the ASHP 4 using a liquid flowing in the conduits 14, 16. Conduits 14, 16 form a circuit between the computing equipment heat storage device 8 and ASHP 4. Conduit 14 is the part of the circuit which passes hot liquid from the heat storage 8 to the evaporator heat exchanger 20 of the ASHP 4. Conduit 16 is the part of the circuit which passes cooler liquid from the evaporator heat exchanger 20 back to the computing equipment heat storage device 8. In other embodiments, any suitable fluid may be used to transfer heat between the computing equipment heat storage device 8 and ASHP 4.

Waste heat from the computing equipment is therefore buffered through the computing equipment heat storage device 8. The use of the computing equipment heat storage device 8 may allow the asynchronous transfer of heat from the computing device 6 to the ASHP 4. The computing device 6 may be used as a computing resource at any time, not only when the house 50 requires heat. For example, the computing resource controller may send processes to the computing device 6 whenever there is demand for the computing resource, whether or not heat is needed by the house 50. The computing device 6 may be switched off or into a lower-power mode when there is a lower requirement for computing resources. The house 50 may request heat at any time, whether or not the computing device 6 is currently operating. Fan 22 of the ASHP 4 blows air 18 (represented by an arrow in Figure 1) from the outside of the house 50 to the evaporator heat exchanger 20 of the ASHP 4. In the embodiment of Figure 1 , air 18 blown by the fan 22 is heated by the hot liquid in conduit 14. In some embodiments, a controller (not shown) controls whether or not heat is supplied from the computing equipment heat storage device 8 to the ASHP 4, thereby turning on or off the pre-heating of the air supplied to the ASHP 4. In some circumstances, the controller may choose to operate the ASHP 4 without pre-heating the air that is input to the ASHP 4. For example, it may be possible for the heating requirements of the house 50 to be met using ambient air and without using heat from the computing equipment heat storage device 8.

In an alternative embodiment the hot liquid in conduit 14 is used to pre-heat the refrigerant in conduit 40 via a heat exchanger. Waste heat from the computing device 6 is passed via the computing equipment heat storage device 8 and is used to pre-heat the refrigerant in conduit 40. Waste heat from the computing device 6 is used to raise the temperature of the refrigerant that is input to compressor 26, which may provide more efficient operation of the ASHP 4.

We turn now to the operation of the ASHP 4. Conduits 40, 42, 45, 46 form a circuit in which a refrigerant passes around the ASHP 4. The refrigerant is a gas at some parts of the circuit, and a liquid at other parts of the circuit. Any suitable refrigerant may be used.

The refrigerant of the ASHP passes into the evaporator heat exchanger 20 as a liquid having a relatively low temperature. The evaporator heat exchanger 20 turns the liquid refrigerant into a gas having a relatively low temperature and pressure.

Conduit 40 passes the low-temperature, low-pressure gas refrigerant to the compressor 26.

The compressor 26 compresses the low-temperature, low-pressure gas refrigerant and outputs the refrigerant into conduit 42 as a high-temperature high-pressure gas. Conduit 42 passes the high-temperature high-pressure gas refrigerant into the condensing heat exchanger 24. The condensing heat exchanger 24 turns the high- temperature high-pressure gas refrigerant into a high-temperature high-pressure liquid. Heat is taken from condensing heat exchanger 24 into a central heating circuit of the house 50 by a liquid medium (for example, water) through a conduit 43 by means of a pump 25. The heat from the condensing heat exchanger 24 is managed by a configurable manifold 27. The configurable manifold 27 has at least two different modes of operation. In a first mode of operation the configurable manifold 27 directs heat from the condensing heat exchanger 24 into a domestic heat storage device 29 in which the heat is stored for future use. In a second mode of operation, the configurable manifold 27 directs heat from the condensing heat exchanger 24 through heat exchanger 28 into the house 50. Fan 30 blows warm air 48 (represented by an arrow in Figure 1) from the condensing heat exchanger 28 into the house 50.

A configurable manifold is described below in greater detail with reference to Figures 2, 3 and 4.

In the embodiment shown in Figure 1 , warm air 48 is output from the ASHP 4. In other embodiments, the domestic heating unit 2 comprises a hot water outlet (not shown in Figure 1) that is configured to supply hot water for single property domestic use. The condensing heat exchanger 28 is used to heat water passing into the hot water outlet. In other embodiments, the domestic heating unit 2 may supply hot water for use in a central heating system, an underfloor heating system or any other heating system in addition to or instead of supplying water to a domestic hot water system. Hot water that is heated by the ASHP 4 may be stored in a hot water tank for future use.

The high-temperature high-pressure liquid refrigerant passes through conduit 45 to the expansion device 32. The expansion device 32 expands the high-pressure high- temperature liquid refrigerant such that it becomes a low-pressure low-temperature liquid, which passes to the evaporator heat exchanger 20 through conduit 46 for the cycle of temperature and pressure to start again.

The domestic heat storage device 29 may be used to store heat that has been generated to allow it to be later released for domestic heating purposes and/or for the supply of hot water. For example, the domestic heat storage device may comprise heat batteries comprising a phase change material, where the heat batteries are configured to store heat for later domestic use. Alternatively, the domestic heat storage device may comprise a hot water tank or other liquid storage. The domestic heat storage device 29 is distinct from the computing equipment heat storage device 8.

In some embodiments, the domestic heating unit 2 further comprises an electrical storage device (not shown in Figure 1), for example an electrical battery. The electrical storage device may be used to store electricity obtained at non-peak times for use at peak times. For example, electricity that is bought at non-peak times may be stored and later used to operate the computing device 6 at peak times when electricity is more expensive. Stored electricity may be used if it is known that electricity supply will be cheap in future. The ASHP 4 and electrical battery may be contained within a single enclosure. The computing device 6 and computing equipment heat storage device 8 may also be contained within the same enclosure.

The efficiency of the ASHP may be matched with the flexibility provided by heat and electrical batteries. Electrical energy may be bought during cheaper times of the day and stored for later use either in the electrical batteries or, after the efficient generation of heat through ASHPs, in heat batteries. The heat batteries may improve the customer experience when compared with standard ASHP use. The electrical batteries may allow resale of electricity back into the grid during more expensive periods (a Demand Side Response service through aggregation).

In some embodiments, the domestic heating unit 2 is at least partially powered by renewable energy. For example, the domestic heating unit 2 may be at least partially powered by solar or wind energy that is co-located with the house 50. The electrical storage may allow electricity generated by renewable sources to be used by the domestic heating unit 2 and/or sold to the grid at a different time from the generation of the electricity. The heat storage may allow heat generated using electricity from renewable sources to be used at a different time from the generation of the electricity. The domestic heating unit 2 may be used to smooth out differences in time between the generation of electricity from renewable sources and the demand for that electricity.

In summary, heat is harvested from the computing device 6 and used in heating the house 50. A data processing system or electronic computer may use significant electrical power all of which may eventually be discarded as waste heat. In the embodiment described above, this heat is harvested for the heating of a domestic home through a heat exchanger. The heat exchanger has the effect of providing cooling for the computing device 6.

In the present embodiment, the computing equipment heat storage device 8 (which may also be referred to as a heat battery) is used to buffer heat between the computing device 6 and the ASHP 4. The embodiment illustrated in Figure 1 shows indirect warming through heat exchanged between multiple closed systems.

In some embodiments, the domestic heating unit 2 stores waste heat from the computing device 6 and uses the stored heat to pre-heat air 18 that is input to the ASHP 4. In other embodiments the stored heat is used to pre-heat a refrigerant of the ASHP.

The ASHP 4 may have improved efficiency due to the waste heat from the computing device 6 being used to pre-heat the air that is input to the ASHP 4 or to pre-heat a refrigerant of the ASHP. For example, the efficiency of an ASHP may be greatly improved in the presence of warmer temperature air as there is greater temperature gradient across the device’s heat exchanger and so more energy may be extracted.

By using the computing equipment heat storage device 8, the supply of heat to the house may be decoupled from the use of the computing resource 6. The supply of heat to the house 50 and the removal of waste heat from the computing resource 6 may be asynchronous.

Typically, for a heat exchanger to be useful to both processes between which heat is exchanged, the needs of both are synchronized. However, the use of thermal storage in the embodiment of Figure 1 allows the asynchronous transfer of heat from one process to the other. Instead of data processing needing to be carried out at a time when the domestic dwelling needs heating, the timings of the data processing and the heating may be independent of each other.

Using waste heat from computing equipment to provide domestic heating may provide a cost-effective and environmentally-friendly method of waste heat disposal. It is known that centralised computing centres often use considerable money and resources to dispose of waste heat, for example by providing high-powered air conditioning systems. Situating computers in a distributed fashion may make waste heat disposal easier. Using waste heat to heat a home (and charging the homeowner or resident for the heating) may offset some of the cost of the processes performed by the computing equipment.

The homeowner or resident may benefit from decreased heating costs. A combination of electric heating (air source heat pump) and energy storage (heat and electrical) may allow homeowners or residents to reduce their carbon footprint without compromising their budget or comfort. A cost benefit may be provided by the use of timer control and by timing electricity use and energy storage in accordance with variable-price electricity tariffs (for example, Economy 7/10 tariffs in the UK).

Domestic heating units 2 may provide distributed energy storage. For example, if domestic heating units 2 are provided to a large number of houses 50, energy storage may be distributed across all of those houses 50. Energy may be stored as heat. In some embodiments, energy may be stored as electricity. Distributed storage may deliver a scalable and robust solution to the needs of renewable (particularly wind) energy generation and may allow spare capacity in storage units to provide Demand Side Response (DSR) services to the grid through aggregation. It may effectively shift the domestic peak demand and reduce pressure on the supply grid.

In some embodiments, the domestic heating unit 2 is owned and operated by a third party (other than the homeowner or resident). The third party sells heat and energy to the homeowner and may also sell surplus energy to further third parties. The third party also sells use of the computing equipment for distributed computing. This may be described as an energy-as-a-service business model. Benefit from the assets may be retained by the third party whilst ensuring system reliability and customer service. Tens of thousands of units may be operated by the third party, controlling hundreds of MWs of supply and demand in support of the grid. The storage capacity in the units may reduce the need to curtail renewable generation and balance the grid.

In the embodiment described above with reference to Figure 1 , computing equipment heat storage device 8 provides a buffer between the computing device 6 and the ASHP 4. In some other embodiments, the computing equipment heat storage device 8 is omitted. In some such embodiments, direct coupling between the cooled low pressure, low temperature liquid from the expansion device and a liquid cooled GPU/CPU processing system may occur. Heat output by the computing device 6 may be supplied directly to the ASHP 4.

In some embodiments, a fan and/or heat exchanger is common to the computing device 6 and the ASHP 4. For example, some embodiments, a single fan removes waste heat from the computing device 6 and delivers the waste heat to the evaporator heat exchanger 20 of the ASHP 4.

A controller (not shown) may control whether air going into the ASHP and/or an ASHP refrigerant is pre-heated by the computing device 6.

Figure 2 is a schematic illustration of a domestic heating unit 200 which shows a configurable manifold in greater detail. In the embodiment of Figure 2, phase change material (PCM) heat storage is used in combination with ASHP heat generation.

An ASHP 4, a domestic heat storage device 29 and a central heating system 230 are connected by a configurable manifold comprising a plurality of conduits 202 to 216 and two three-port T valves MV1 , MV2. A controller (not shown) is configured to operate the T valves to switch between four modes of operation. A conduit 218 supplies mains water to the domestic heat storage device 29 and a further conduit 220 outputs hot water that has been heated by the domestic heat storage device 29.

A method of operation of the domestic heating unit is shown in overview in the flow chart of Figure 3. The four modes of operation of the configurable manifold are shown schematically in Figure 4.

A first stage 300 of the flow chart of Figure 3 is an optional stage of inputting user requirements. A controller receives user requirements that are input by a user. For example, a user may request heating or hot water, or may change a temperature of heating required. The controller may also be referred to as a digital system controller. The controller may be implemented as any suitable component, for example as a microprocessor. In some embodiments, a single controller controls multiple aspects of the domestic heating unit. For example, a single controller may control the operation of the configurable manifold supplying heat to the central heating system, and the use of the computer equipment heat storage device 8 to pre-heat the ASHP. In some circumstances, the controller may also control operation of the ASHP 4, domestic heat storage unit 29, and/or computing device 6. In other embodiments, separate controllers control different aspects of the domestic heating unit 2. Each controller may comprise a digital system controller. Each controller may be implemented on a respective microprocessor, or multiple controllers may be implemented on a single microprocessor.

At stage 302, the controller monitors a system status. At stage 304, the controller determines whether a system reconfiguration is required. The system reconfiguration may comprise changing a mode of operation of the configurable manifold. If no system reconfiguration is required, the method of Figure 3 returns to stage 302 for continuing monitoring of the system status.

If reconfiguration is required, the method proceeds to stage 306. The controller sets a manifold configuration according to the port configurations shown in Figure 4. At stage 308 the controller updates a heat generator setting. For example, the controller may turn the ASHP 4 on or off, or change operational settings of the ASHP 4.

Figure 4 shows settings of the T-ports MV1 , MV2 in each mode of operation. In a first mode of operation, MV1 has a setting 310 in which it receives a fluid input from conduit 208 and outputs fluid to conduit 216. MV2 has a setting 312 in which it receives a fluid input from conduit 202 and outputs fluid to conduit 204. The first mode of operation may be described as heating without battery boost. Hot fluid flows out of the ASHP 4 through MV2 into conduit 204 to the central heating system 230. Fluid then flows from the central heating system 230 through conduits 206, 208 to MV1 and back to a pump without entering the heat battery 29. Fluid returns to the ASHP from MV1 via conduit 214.

The second mode of operation may be describes as battery charging with no heating. MV1 has a setting 320 in which it receives a fluid input from conduit 208 and outputs fluid to conduit 216. MV2 has a setting 322 in which it receives a fluid input from conduit 202 and outputs fluid to conduit 210. Hot fluid flows out of the ASHP 4 through conduit 202, through MV2, and through conduits 210, 216 to the heat battery 29. After depositing heat in the heat battery 29, fluid flows through conduits 212, 208 to MV1 and into ASHP return conduit 214.

The third mode of operation may be described as heating on with battery boost. MV1 has a setting 330 in which it receives a fluid input from conduit 216 and outputs fluid to conduit 214. MV2 has a setting 332 in which it receives a fluid input from conduit 202 and outputs fluid to conduit 204. Hot fluid flows out from ASHP 4 through MV2 and conduit 204 to the central heating system 230. Fluid flows out of the central heating system 230 through conduits 206, 212 to the heat battery 29. Fluid returns from the heat battery 29 through conduit 216 to MV1 and then through conduit 214 to the ASHP 4. Heat from the battery boosts return temperatures to the ASHP return via MV1. The boosting may result in a rapid rise to the temperature of the ASHP 4 and lower energy use at peak times.

In a fourth mode of operation, all routes through the T-ports are open (settings 340, 342) for system filling.

We now consider in more detail the combination of computing device 6 and computing equipment heat storage that is used to provide a heat buffer between the computing device 6 and ASHP 4. In the embodiment of Figure 1 above, a single computing equipment heat storage device 8 is shared between hot and cold processes. The processing units of an electrical computer (computing device 6) is a hot process requiring cooling. The heat harvesting stage of an air source heat pump 4 is a cold process requiring heating. The single thermal storage device 8 is used to cool the hot process and heat the cold process. The operation of a system having a single thermal storage device is shown schematically in Figure 5.

In Figure 5, heat is exchanged between a cold process 60 and a hot process 64 by asynchronous heat exchange through thermal storage 62. A cold loop 66 connects the thermal storage 62 and the cold process 60. Fluid circulates in the cold loop 66 to transfer heat from the thermal storage 62 to the cold process 60, and return cold fluid to the thermal storage 62. A hot loop 68 connects the thermal storage 62 and the hot process 64. Fluid circulates through the hot loop 68 to transfer heat from the hot process 64 to the thermal storage 62, and return cooled fluid to the hot process 64.

In other embodiments, separate hot and cold storage are mixed through a common control loop. Separate hot and cold storage may be kept at different temperatures as required. Figure 6 is a schematic illustration of a system using separate cold storage and heat storage.

Figure 6 again involves a transfer of heat between a hot process 76 (for example, data processing by a computing device) and a cold process 70 (for example, heating of a house). The system of Figure 6 comprises two thermal batteries: a cold storage thermal battery 72 and a heat storage thermal battery 74. The heat storage 74 is kept at a higher temperature than the cold storage 72. Each of the heat storage 74 and cold storage 72 may comprise a respective phase change material. In other embodiments, any suitable form of heat storage and cold storage may be used.

A cold loop 78 transfers heat between the cold process 70 and the cold storage 72. Fluid circulates in the cold loop 78 to transfer heat from the cold storage 72 to the cold process 70, and return cold fluid to the cold storage 72. It may alternatively be considered that the cold loop 78 transfers cold from the cold process 78 to the cold storage 72, and returns a less cold fluid to the cold process 78. In embodiments, the ASHP 4 is used to refrigerate a phase change material of the cold storage 72. The refrigerated phase change material may then enable the later cooling of a heat generating process.

A cold storage battery 72 may have a phase change material tuned to freeze at a lower temperature than a phase change material of the heat storage battery 74. For example, a phase change material of the cold storage battery 72 may be tuned to freeze at a temperature that is just above a temperature of the refrigerant, for example minus 30°C. The phase change material will then freeze when charged up by the ASHP, and extract heat from warmer liquids subsequently put through the battery.

A hot loop 82 transfers heat between the hot process 76 and the heat storage 74. Fluid circulates through the hot loop 82 to transfer heat from the hot process 76 to the heat storage 74, and return cooled fluid to the hot process 76. A control loop 80 transfers heat between the cold storage 72 and heat storage 74. A controller (not shown) may control the transfer of heat between the cold storage 72 and heat storage 74. For example, the controller may control the transfer of heat based on the temperature of each of the cold storage 72 and heat storage 74 and/or the heating and cooling needs of the cold process 70 and hot process 76.

By using two separate heat batteries, greater control of the heating and cooling processes may be obtained.

In general, for domestic heating a phase change material may be used that melts at around 58°C. Microprocessors may run at a much higher temperature, for example up to 85°C. An ASHP refrigerant may run at a much lower temperature, for example down to -30°C. Therefore, it may be useful to have two heat batteries: one tuned for the hot process 76 and one tuned for the cold process 70. Heat may then be passed between the heat batteries in a controller manner by controlling the flow within a central loop.

In further embodiments, the domestic heating unit 2 further comprises a conventional heat exchanger that uses the environment as a thermal buffer for the system and does not comprise heat storage. Such a system may be used when one or more of the processes in the system has a thermal character significantly different to the ambient environment.

Figure 7 is a schematic illustration of a system comprising a cold process 90, a hot process 94 and a heat storage device 92. A cold loop 98 transfers heat between the heat storage 92 and the cold process 90. A hot loop 100 transfers heat between the hot process 94 and the heat storage 92.

The system of Figure 7 comprises an ambient environment heat exchanger 96. The ambient environment heat exchanger 96 may also be referred to as a liquid-air heat exchanger or an ambient temperature buffer. The ambient environment heat exchanger 96 is configured to exchange heat with the environment. The ambient environment heat exchanger 96 is connected to both the cold loop 98 and the hot loop 100. Having passed through the thermal storage 92, the hot and cold loops 98, 100 continue to pass through a liquid-air heat exchanger 96 to ensure the liquid medium is of an acceptable temperature whatever the heat of the thermal storage.

In some embodiments, fan and/or heat exchanger of the ASHP 4 is common with that of the ambient temperature buffer.

In further embodiments, a plurality of ambient environment heat exchangers may be used. For example, the hot loop and cold loop may each use a separate ambient environment heat exchanger.

Hot fluid passes through the hot loop 100 from the hot process 94 to the thermal storage 92. The part of the hot loop connecting the hot process 94 and the heat storage 92 may be referred to as a hot storage loop. Heat is transferred from the hot fluid to the thermal storage 92. Cooler fluid then passes through a further part of the hot loop 100, which may be referred to as the hot air exchange loop. The hot air exchange loop passes the fluid through the ambient environment heat exchanger 96. In the ambient environment heat exchanger 92, further heat may be lost into the environment (depending on the temperatures of the ambient environment and of the fluid). Fluid then passes from the ambient environment heat exchanger 96 to the hot process 94. By using the ambient environment heat exchanger 96, the fluid passing into the hot process 94 may be kept at a consistent temperature. When the thermal storage 92 is full, the ambient environment heat exchanger 92 may act as a buffer to warm the cold loop or cool the hot loop.

Fluid passes through the cold loop 98 from the heat storage 92 into the ambient environment heat exchanger 96 and then flows from the ambient environment heat exchanger 96 to the cold process 90. The part of the cold loop 98 passing through the ambient environment heat exchanger 96 may be referred to as a cold air exchange loop. Cooler fluid then flows from the cold process 90 to the thermal storage 92. The part of the cold loop 98 connecting the cold process 90 and the heat storage 92 may be referred to as a cold storage loop.

In some embodiments, a controller (not shown) controls whether the cold loop 98 and/or the hot loop 100 passes through the ambient environment heat exchanger 96. For example, the ambient environment heat exchanger 96 may only be used in certain temperature conditions.

An ambient environment heat exchanger, for example an ambient environment heat exchanger 96 as described above with reference to Figure 7, may be combined with any of the systems described above, for example systems as described with reference to any of Figures 1 to 6.

The ambient environment heat exchanger may be used in a system that has both heat storage and cold storage, for example a system as described above with reference to Figure 6. It may be the case that the heat storage battery or cold storage battery becomes full. The heat storage battery may become full at 85°C, for example if the ASHP has not been run to remove heat. The cold storage battery may become full at - 30°C, for example, if the computing device has not been run and so has not used cooling. If one of the batteries should become full, the ambient environment heat exchanger may provide heating to the ASHP or cooling to the computer. The ambient environment heat exchanger may be considered to provide a fail-safe mechanism.

Without appropriate control, in certain situations it may be inefficient to always run the heating or cooling circuit through an ambient temperature buffer. For example if, after passing through the thermal storage, the cooled medium in the hot process exchange loop is cooler than the ambient temperature then may not be beneficial to then pass it through the ambient temperature buffer. By always going through the heat environment heat exchanger, control over the final temperature of the conduit mediums may be lost. The use of the ambient temperature buffer may be switchable to enable it to be brought in and out of use as appropriate.

Figure 8 is a schematic illustration of a system in which an ambient environment heat exchanger can be switched in and out of a cold loop and/or a hot loop.

The system of Figure 8 comprises a cold process 110, a hot process 114 and a heat storage device 112. The system further comprises an ambient environment heat exchanger 116. The system comprises two switches 130, 132. Each switch 130, 132 comprises a respective valve which is configured to change a direction of fluid flow. Switch 130 is used to switch between a first cold loop 118, 122 and a second cold loop 120, 122. The first cold loop 118, 122 is similar to that shown in Figure 7. Section 118 of the first cold loop passes fluid from the heat storage 112 into the ambient environment heat exchanger 116 and from the ambient environment heat exchanger 116 to the cold process 110. Section 122 passes fluid from the cold process 110 to the thermal storage 112. Section 122 is common to the first and second cold loops.

The second cold loop 120, 122 bypasses the ambient environment heat exchanger 116. Section 120 of the second cold loop passes fluid from the heat storage 112 to the cold process 110 without passing through the ambient environment heat exchanger 116. The first switch 130 controls whether the fluid leaving the heat storage 112 for the cold loop passes through section 118 or section 120.

In further embodiments, the system may be configured such that one or both of the processes go only through the ambient environment heat exchanger and do not pass through the heat storage. In such embodiments, the valves used to control the fluid flow may be changed from L types to T types.

Switch 132 is used to switch between a first hot loop 124, 128 and a second hot loop 126, 128. The first hot loop 124, 128 is similar to that shown in Figure 7. Section 124 of the first hot loop passes fluid from the heat storage 112 into the ambient environment heat exchanger 116 and from the ambient environment heat exchanger 116 to the hot process 114. Section 128 passes fluid from the hot process 114 to the thermal storage 112. Section 128 is common to the first and second hot loops.

The second hot loop 124, 128 bypasses the ambient environment heat exchanger 116. Section 124 of the second cold loop passes fluid from the heat storage 112 to the hot process 114 without passing through the ambient environment heat exchanger 116. The second switch 132 controls whether the fluid leaving the heat storage 112 for the hot loop passes through section 124 or section 126.

In further embodiments, switching of the ambient environment heat exchanger 116 may be combined with the use of separate cold storage and heat storage. In a further embodiment, a switching circuit (not shown) controls switches to select whether to use an ambient environment heat exchanger. A method of control of the switching circuit is shown in the flow chart of Figure 9. In the embodiment of Figure 9, the domestic heating unit resembles that of Figure 8 in that it includes switches to switch between different hot loops and cold loops. However, the system of Figure 9 has separate hot storage and cold storage.

The control method of Figure 9 receives a plurality of different types of input data 140, 142, 144, 146. A first type of input data 140 comprises data regarding the cooling needs for a hot process. For example, input data 140 may comprise a current or future processing load of a computing device and a current temperature of the computing device. The temperature measured using a temperature sensor at the computing device.

A second type of input data 142 comprises sensor data, which in the present embodiment comprises a sensed hot store status, a sensed cold store status, and an ambient temperature. The sensed hot store status may comprise a temperature of the hot storage and may be measured by a temperature sensor at the hot store. The sensed cold store status may comprise a temperature of the cold storage and may be measured by a temperature sensor at the cold store. The ambient temperature may be measured by a temperature sensor in any suitable location, for example near the ambient temperature heat exchanger.

A third type of input data 144 comprises a set of pre-defined coefficients to be used in the control method. In some embodiments, the pre-defined coefficients are installed as part of the domestic heating unit system. In some embodiments, the pre-defined coefficients may be selected and changed by a user. The pre-defined coefficients may relate to, for example, conditions for changing a mode of operation of the domestic heating unit. The predefined coefficients may comprise a set of weightings for weighting the importance of different conditions (for example, temperatures and/or heating or cooling needs).

A fourth type of input data 144 comprises data regarding the heating needs for the cold process. For example, input data 144 may comprise a current temperature measure in one or more locations in the house by one or more temperature sensors, a setting for a heating timer, one or more thermostat settings, and one or more radiator settings.

At stage 150 of the flow chart of Figure 9, the switching circuitry receives input data 140 regarding the cooling needs for the hot process, input data 142 which comprises sensed hot and cold store status and ambient air temperature, and input data 144 which comprises the pre-defined coefficients. The switching circuitry compares cooling strategies based on the input data 140, 142, 144. The comparing of the cooling strategies may comprise processing the cooling needs 140 and sensor data 142 using the pre-defined coefficients 144.

At stage 152, the switching circuitry decides which heat sink or heat sinks to use to use. In the present embodiment, the switching circuitry decides whether to use the cold store as a heat sink and/or to use the ambient air as a heat sink.

If the ambient air is selected, the method of the flow chart proceeds to stage 154. The switching circuitry selects a routing of the hot loop so that the hot process is cooled through ambient air using the ambient environment heat exchanger.

If the cold store is selected, the method of the flow chart proceeds to stage 156. The switching circuitry selects a routing of the hot loop such that the hot process is cooled using cold storage. For example, the switching circuitry may select a hot loop that connects the hot process and the heat storage, and also transfer heat from the heat storage to the cold storage.

In some circumstances, the switching circuitry may choose to cool the computing device using both the ambient air and the cold storage. In other circumstance, only one or the other of the ambient air and cold storage may be used.

At stage 160 of the flow chart of Figure 9, the switching circuitry receives input data 146 regarding the heating needs for the cold process, input data 142 which comprises sensed hot and cold store status and ambient air temperature, and input data 144 which comprises the pre-defined coefficients. The switching circuitry compares heating strategies based on the input data 146, 142, 144. At stage 162, the switching circuitry decides which heat source to use. In the present embodiment, the switching circuitry decides whether to use the ambient air as a heat source and/or to use the hot store as a heat source.

If the ambient air is selected, the method of the flow chart proceeds to stage 164. The switching circuitry selects a routing of the cold loop so that the cold process is heated from the ambient air using the ambient environment heat exchanger.

If the hot store is selected, the method of the flow chart proceeds to stage 166. The switching circuitry selects a routing of the cold loop such that the cold process is heated using hot storage. For example, the switching circuitry may select a cold loop that connects the cold process and the cold storage, and also transfer heat from the heat storage to the cold storage.

In some circumstances, the switching circuitry may choose to heat the house using both the ambient air and the hot storage. In other circumstance, only one or the other of the ambient air and hot storage may be used.

In further embodiments any suitable controller and/or switching circuitry may be used to control the operation of the domestic heating unit 2. For example, the controller and/or switching circuitry may control a temperature of one or more temperature storage devices, whether heat is supplied by heat storage, and whether cold is supplied from cold storage. The controller and/or switching circuitry may be operated using any suitable control algorithms.

The switching method as described with reference to Figure 9 may be combined with any of the systems described above, for example the systems of any of Figures 1 to 8.

In the description above, we have discussed the control of the domestic heating unit 2 to meet the heating demands of a single domestic property 50 and the cooling demands of a single computing device 6.

However, in further embodiments, the domestic heating unit 2 may also be controlled in response to conditions outside the domestic heating unit 2 and house 50. For example, as described above, the domestic heating unit 2 may store energy as electricity and/or heat when electricity costs are low, and then use the stored energy when electricity costs are high. Electricity costs may be high due to high customer demand and/or reduced energy supply.

In some embodiments, a central controller controls the operation of multiple domestic heating units 2 that form a network, for example a local or micro-local network. For example, the central controller may instruct the domestic units 2 to store energy or to use energy based on electricity pricing and/or other conditions in the electricity grid.

The same central controller, or a different computing resource controller, may control operation of the computing devices 6 in the domestic heating units 2. For example, the operation of the computing devices 6 may be controlled in response to computing demands. The operation of the computing devices 6 may be balanced, for example to balance electricity demand locally.

Computing processes performed may also be controlled based on conditions that are local to the domestic heating unit. For example, a clocking speed of a processor of the computing device 6 may be controlled based on a temperature of a cold store. In some circumstances, excess cooling power may be used to increase the computing that is performed by the computing device 6.

The computing device 6 implemented in the domestic heating unit 2 may be used to perform any suitable computing process. For example, the computing device may be used to perform neural-based machine learning.

Neural computing benefits from processing in parallel across a network of relatively simple processing units. This may provide a number of desired features. The system may be robust to partial failures. The system may exhibit a graceful degradation during a loss of performance. The system may can be distributed over a number of geographic locations, protecting it from localized issues. The system may return a statistically acceptable solution to a highly complex, and potential intractable, problem very quickly because of its intrinsic parallelism. Because of the relatively simple processing requirements of the system, it may be supported on many different hardware platforms. In many cases, the market has decided to implement new data analytics centres as centralized units covering thousands of square feet, requiring the installation of a significant communication infrastructure, huge power requirements and, because all power in a data centre is ultimately converted to heat (Cisco Unified Computing System Site Planning Guide: Data Center Power and Cooling, 2017), a major investment in centre design (with hot-aisle cold-aisle layout and cabling strategy) and heat dissipation and device cooling. Such designs take millions of processing units and put them all in one place. Hence they also take MWs of power and, often literally, pump it into the atmosphere.

By using domestic heating units as described above, the parallelism of the machine learning platforms may be exploited to host discrete processing modules in each of the domestic heating unit that can then piggy-back onto an existing network.

In embodiments, a relatively small and inexpensive (for example, Tesla or CUDA) GPU array is housed in each of a plurality of domestic heating units. This unit then benefits from an, effective, 13 kWh uninterruptable power supply fed by renewable energy and cooling by a cold ASHP circuit designed to harvest and store heat for the efficient heating of domestic residences. It also has its own broadband link with the Internet which, when aggregated up over the entire processing system may provide very high bandwidth without the need for additional communication infrastructure.

The software platform used to enable this hardware model already exists. For example, Apache Hadoop software library is a framework that supports the distributed processing of large data sets across clusters of computers using simple programming models. It is designed to scale up from single servers to thousands of machines, each offering local computation and storage. It is a platform that has been adopted industry wide for distributed processing.

The domestic heating unit 2 described above is configured to provide heat and/or hot water to a single domestic residence. In further embodiments, one or more heating units similar to those described above may be used to provide heat to any suitable building or structure, which may not be a domestic residence. For example, heating units may be used to heat offices or schools. A plurality of heating units may be used to heat a variety of different buildings. The operation heating units may be controlled by one or more central controllers.

A skilled person will appreciate that variations of the enclosed arrangement are possible without departing from the invention. Accordingly, the above description of the specific embodiment is made by way of example only and not for the purposes of limitations. It will be clear to the skilled person that minor modifications may be made without significant changes to the operation described.