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Patent Searching and Data


Title:
DOUBLE GOLD PLATING METHOD AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2015/097917
Kind Code:
A1
Abstract:
Provided are: a low-cost gold plating method having excellent anticorrosion properties; and an electronic component which is produced using this gold plating method. In this double gold plating method, a base gold plating layer (2) is formed on the surface of a material to be plated (1) in a first plating process, and then a finishing gold plating layer (5) is formed on the surface of the base gold plating layer (2) by having gold crystals finer than those during the formation of the base gold plating layer (2) precipitate on the surface of the base gold plating layer (2) in a second plating process.

Inventors:
HAYASHI SHIGERU (JP)
Application Number:
PCT/JP2013/085281
Publication Date:
July 02, 2015
Filing Date:
December 28, 2013
Export Citation:
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Assignee:
NICHIEI GIKEN KABUSHIKI KAISHA (JP)
International Classes:
C25D5/10; C25D3/48; C25D7/00
Foreign References:
JPH04217226A1992-08-07
JPH11293487A1999-10-26
Attorney, Agent or Firm:
NAKAI, HIROYUKI (JP)
Hiroyuki Nakai (JP)
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