DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE MEMBERS

Title:

DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIVE MEMBERS

Document Type and Number:

WIPO Patent Application WO/2022/231308

Kind Code:

A1

Abstract:

Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex polygon (e.g., convex pentagon).

Inventors:

CHOI CHEULWON (KR)
KIM JONGSUN (KR)
KWEON HYOSHIK (KR)
LEE JAEHOON (KR)
LEE BYUNGCHUL (KR)
LEE MINKYU (KR)

Application Number:

PCT/KR2022/006034

Publication Date:

November 03, 2022

Filing Date:

April 27, 2022

Export Citation:

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Assignee:

GLOBALWAFERS CO LTD (TW)

International Classes:

B24B37/08; B24B37/24; B24D3/10; B24D18/00; H01L21/67

Foreign References:

US20180290265A1	2018-10-11
JP2018130791A	2018-08-23
US20080020684A1	2008-01-24
CN202088116U	2011-12-28
JP2006224201A	2006-08-31

Attorney, Agent or Firm:

CHANG, Duck Soon et al. (KR)

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