Title:
DOUBLE-SIDE POLISHING DEVICE CARRIER, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/105306
Kind Code:
A1
Abstract:
The present invention provides a double-side polishing device carrier for a double-side polishing device which performs double-side polishing of a semiconductor silicon wafer, wherein the double-side polishing device carrier is disposed between upper and lower surface plates each having polishing cloth attached thereto, and is formed with holding holes for holding the semiconductor silicon wafer being sandwiched between the upper and lower surface plates during polishing. The double-side polishing device carrier is made of resin, has an average contact angle value of not less than 45° and not more than 60° with respect to pure water on front and back surfaces that contact the polishing cloth, wherein a difference between the average contact angle values on a front surface and a back surface is not more than 5°. Thus, there are provided a double-side polishing device carrier which uses a resin carrier and with which the rate of polishing of a semiconductor silicon wafer can be improved, and a double-side polishing device and a double-side polishing method using the same.
Inventors:
TANAKA YUKI (JP)
KITAZUME DAICHI (JP)
KITAZUME DAICHI (JP)
Application Number:
PCT/JP2017/040503
Publication Date:
June 14, 2018
Filing Date:
November 10, 2017
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B37/08; B24B37/28
Foreign References:
| JP2014166677A | 2014-09-11 | |||
| JP2015123553A | 2015-07-06 | |||
| JP2015009315A | 2015-01-19 | |||
| JP2013132744A | 2013-07-08 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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