DOUBLE-SIDE POLISHING DEVICE AND DOUBLE-SIDE POLISHING METHOD FOR WORKPIECE

WIPO Patent Application WO/2019/130757

A1

Provided are a double-side polishing device and a double-side polishing method with which it is possible to end double-side polishing when a workpiece has obtained an intended shape in the middle of double-side polishing. An arithmetic unit (13) of a double-side polishing device (1) determines when to end double-side polishing by performing: a first step for classifying workpiece thickness data, measured by a workpiece thickness measuring device (11), for each workpiece; a second step for extracting, for each workpiece, workpiece shape components from the workpiece thickness data; a third step for specifying the positions, in the radial direction of the workpiece, of the extracted workpiece shape components on the measured workpiece; a fourth step for calculating a workpiece shape distribution from the workpiece shape components and the specified positions, in the radial direction of the workpiece, on the workpiece; a fifth step for acquiring a workpiece shape index from the calculated workpiece shape distribution; and a sixth step for determining when to end the double-side polishing performed on the workpiece, on the basis of the acquired workpiece shape index.

KUBOTA MAMI (JP)
TAKANASHI KEIICHI (JP)

PCT/JP2018/039167

July 04, 2019

October 22, 2018

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SUMCO CORP (JP)

B24B37/005; B24B37/013; B24B37/08; B24B49/04; H01L21/304; B24B49/12

JP2015047656A	2015-03-16
JP2017207455A	2017-11-24
JP2012019114A	2012-01-26
JP2017204609A	2017-11-16

SUGIMURA Kenji (JP)

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